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Volumn 88, Issue 5, 2011, Pages 837-843

Integration and electrical characterization of carbon nanotube via interconnects

(9) Chiodarelli, Nicolo' a,b Li, Yunlong a Cott, Daire J a Mertens, Sofie a Peys, Nick a Heyns, Marc a,c De Gendt, Stefan a,c Groeseneken, Guido a,b Vereecken, Philippe M a,c

a IMEC (Belgium)

b Katholieke Universiteit Leuven (Belgium)

c UNIVERSITY OF LEUVEN (Belgium)

Author keywords

Carbon nanotubes; CNT; Contact; Electrical characterization; Integration; Interconnect

Indexed keywords

ANNEALING TREATMENTS; BACK END OF LINES; CNT; CONTACT; CONTACT HOLES; COPPER TECHNOLOGY; ELECTRICAL CHARACTERIZATION; ELECTRICAL PROPERTY; ELECTRICAL RESISTANCES; FUTURE GENERATIONS; HIGH QUALITY; INTERCONNECT; METAL CONTACTS; METAL PAD; PRACTICAL REALIZATIONS; PROMISING MATERIALS; PVD FILM; SUBMICRON; TEST VEHICLE; THERMAL BUDGET; VIA RESISTANCE; WAFER SCALE;

CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; ELECTRIC PROPERTIES; INTEGRATION; MECHANICAL STABILITY; MICROPROCESSOR CHIPS; SILICON COMPOUNDS; TUNGSTEN;

CARBON NANOTUBES;

EID: 79251571257 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2010.06.017 Document Type: Conference Paper

Times cited : (60)

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