-
1
-
-
39249085918
-
-
J. Kong, E. Yenilmez, T. W. Tombler, W. Kim and H. Dai: Phys. Rev. Lett. 87 (2001) 106801.
-
(2001)
Phys. Rev. Lett.
, vol.87
, pp. 106801
-
-
Kong, J.1
Yenilmez, E.2
Tombler, T.W.3
Kim, W.4
Dai, H.5
-
3
-
-
8644228615
-
-
IEEE, San Francisco
-
M. Nihei, M. Horibe, A. Kawabata and Y. Awano: International Interconnect Technology Conference 2004 (IEEE, San Francisco, 2004) p. 251.
-
(2004)
International Interconnect Technology Conference 2004
, pp. 251
-
-
Nihei, M.1
Horibe, M.2
Kawabata, A.3
Awano, Y.4
-
4
-
-
28244463477
-
-
IEEE, San Francisco
-
M. Nihei, D. Kondo, A. Kawabata, S. Sato, H. Shioya, M. Sakaue, T. Iwai, M. Ohfuti and Y. Awano: IEEE International Interconnect Technology Conference 2005 (IEEE, San Francisco, 2005) p. 234.
-
(2005)
IEEE International Interconnect Technology Conference 2005
, pp. 234
-
-
Nihei, M.1
Kondo, D.2
Kawabata, A.3
Sato, S.4
Shioya, H.5
Sakaue, M.6
Iwai, T.7
Ohfuti, M.8
Awano, Y.9
-
5
-
-
0036776404
-
-
F. Kreupl, A. P. Graham, G. S. Duesberg, W. Steinhögl, M. Liebau, E. Unger and W. Höenlei: Microelectron. Eng. 64 (2002) 399.
-
(2002)
Microelectron. Eng.
, vol.64
, pp. 399
-
-
Kreupl, F.1
Graham, A.P.2
Duesberg, G.S.3
Steinhögl, W.4
Liebau, M.5
Unger, E.6
Höenlei, W.7
-
6
-
-
79956035984
-
-
J. Li, R. Stevens, L. Delzeit, H. T. Ng, A. Cassell, J. Han and M. Meyyappan: Appl. Phys. Lett. 81 (2002) 910.
-
(2002)
Appl. Phys. Lett.
, vol.81
, pp. 910
-
-
Li, J.1
Stevens, R.2
Delzeit, L.3
Ng, H.T.4
Cassell, A.5
Han, J.6
Meyyappan, M.7
-
7
-
-
21244470717
-
-
M. Nihei, A. Kawabata, D. Kondo, M. Horibe, S. Sato and Y. Awano: Jpn. J. Appl. Phys. 44 (2005) 1626.
-
(2005)
Jpn. J. Appl. Phys.
, vol.44
, pp. 1626
-
-
Nihei, M.1
Kawabata, A.2
Kondo, D.3
Horibe, M.4
Sato, S.5
Awano, Y.6
-
8
-
-
54949138827
-
-
J. Robertson, G. Zhong, H. Telg, C. Thomsen, J. M. Warner, G. A. D. Briggs, U. Detlaff, S. Roth and J. Dijon: Phys. Status Solidi B 245 (2008) 2303.
-
(2008)
Phys. Status Solidi B.
, vol.245
, pp. 2303
-
-
Robertson, J.1
Zhong, G.2
Telg, H.3
Thomsen, C.4
Warner, J.M.5
Briggs, G.A.D.6
Detlaff, U.7
Roth, S.8
Dijon, J.9
-
10
-
-
70349441354
-
-
Y. Yamazaki, N. Sakuma, M. Katagiri, M. Suzuki, T. Sakai, S. Sato, M. Nihei and Y. Awano: Appl. Phys. Express 1 (2008) 034004.
-
(2008)
Appl. Phys. Express
, vol.1
, pp. 034004
-
-
Yamazaki, Y.1
Sakuma, N.2
Katagiri, M.3
Suzuki, M.4
Sakai, T.5
Sato, S.6
Nihei, M.7
Awano, Y.8
-
11
-
-
36349032609
-
-
IEEE, Burlingame
-
S. Sato, M. Nihei, A. Mimura, A. Kawabata, D. Kondo, H. Shioya, T. Iwai, M. Mishima, M. Ohfuti and Y. Awano: IEEE International Interconnect Technology Conference 2006 (IEEE, Burlingame, 2006) p. 230.
-
(2006)
IEEE International Interconnect Technology Conference 2006
, pp. 230
-
-
Sato, S.1
Nihei, M.2
Mimura, A.3
Kawabata, A.4
Kondo, D.5
Shioya, H.6
Iwai, T.7
Mishima, M.8
Ohfuti, M.9
Awano, Y.10
-
12
-
-
34748874836
-
-
IEEE, Burlingame
-
M. Nihei, T. Hyakushima, S. Sato, T. Nozue, M. Norimatsu, M. Mishima, T. Murakami, D. Kondo, A. Kawabata, M. Ohfuti and Y. Awano: IEEE International Interconnect Technology Conference 2007 (IEEE, Burlingame, 2007) p. 204.
-
(2007)
IEEE International Interconnect Technology Conference 2007
, pp. 204
-
-
Nihei, M.1
Hyakushima, T.2
Sato, S.3
Nozue, T.4
Norimatsu, M.5
Mishima, M.6
Murakami, T.7
Kondo, D.8
Kawabata, A.9
Ohfuti, M.10
Awano, Y.11
-
13
-
-
50949094309
-
-
IEEE, Burlingame
-
A. Kawabata, S. Sato, T. Nozue, T. Hyakushima, M. Norimatsu, M. Mishima, T. Murakami, D. Kondo, K. Asano, M. Ohfuti, H. Kawarada, T. Sakai, M. Nihei and Y. Awano: IEEE International Interconnect Technology Conference 2008 (IEEE, Burlingame, 2008) p. 237.
-
(2008)
IEEE International Interconnect Technology Conference 2008
, pp. 237
-
-
Kawabata, A.1
Sato, S.2
Nozue, T.3
Hyakushima, T.4
Norimatsu, M.5
Mishima, M.6
Murakami, T.7
Kondo, D.8
Asano, K.9
Ohfuti, M.10
Kawarada, H.11
Sakai, T.12
Nihei, M.13
Awano, Y.14
-
14
-
-
34748913688
-
-
2006 JSAP, Yokohama
-
M. Nihei, A. Kawabata, T. Hyakushima, S. Sato, T. Nozue, D. Kondo, H. Shioya, T. Iwai, M. Ohfuti and Y. Awano: 2006 International Conference on Solid State Devices and Materials (JSAP, Yokohama, 2006) p. 140.
-
(2006)
International Conference on Solid State Devices and Materials
, pp. 140
-
-
Nihei, M.1
Kawabata, A.2
Hyakushima, T.3
Sato, S.4
Nozue, T.5
Kondo, D.6
Shioya, H.7
Iwai, T.8
Ohfuti, M.9
Awano, Y.10
-
15
-
-
34248366606
-
-
Y. Awano, S. Sato, D. Kondo, M. Ohfuti, A. Kawabata, M. Nihei and N. Yokoyama: Phys. Status Solidi A 203 (2006) 3611.
-
(2006)
Phys. Status Solidi A
, vol.203
, pp. 3611
-
-
Awano, Y.1
Sato, S.2
Kondo, D.3
Ohfuti, M.4
Kawabata, A.5
Nihei, M.6
Yokoyama, N.7
-
17
-
-
11444268193
-
-
S. Sato, A. Kawabata, D. Kondo, M. Nihei and Y. Awano: Chem. Phys. Lett. 402 (2005) 149.
-
(2005)
Chem. Phys. Lett.
, vol.402
, pp. 149
-
-
Sato, S.1
Kawabata, A.2
Kondo, D.3
Nihei, M.4
Awano, Y.5
-
18
-
-
0003637235
-
-
2nd ed. Wiley, New York
-
P. A. Baron and K. Willeke: Aerosol Measurements: Principles, Techniques, and Applications, 2nd ed. (Wiley, New York, 2001) p. 75.
-
(2001)
Aerosol Measurements: Principles, Techniques, and Applications
, pp. 75
-
-
Baron, P.A.1
Willeke, K.2
-
19
-
-
50949114110
-
-
IEEE, Burlingame
-
J. C. Coiffic, M. Fayolle, H. Le Poche, S. Maitrejean and S. Olivier: IEEE International Interconnect Technology Conference 2008 (IEEE, Burlingame, 2008) p. 153.
-
(2008)
IEEE International Interconnect Technology Conference 2008
, pp. 153
-
-
Coiffic, J.C.1
Fayolle, M.2
Le Poche, H.3
Maitrejean, S.4
Olivier, S.5
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