Effects of proximity on hardness and elastic modulus measurements of SiO2 and Cu by nanoindentation

Tribology Letters

Volumn 49, Issue 1, 2013, Pages 85-94

  Kim, Hae Jin ^a   Kim, Dae Eun ^a  

^a Yonsei University   (South Korea)

Author keywords

Copper; Hardness; Nano tribology; Stress analysis

Indexed keywords

DUCTILE MATERIALS; FINITE ELEMENT METHOD SIMULATION; HARDNESS AND ELASTIC MODULUS; MEASUREMENTS OF; NANOINDENTATION BEHAVIOR; NANOINDENTATION TECHNIQUES;

COPPER; ELASTIC MODULI; HARDNESS; SILICON OXIDES; STRESS ANALYSIS;

NANOINDENTATION;

EID: 84874483730     PISSN: 10238883     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11249-012-0050-5     Document Type: Article

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