Alucone interlayers to minimize stress caused by thermal expansion mismatch between Al2O3 films and Teflon substrates

ACS Applied Materials and Interfaces

Volumn 5, Issue 3, 2013, Pages 1165-1173

  Jen, Shih Hui ^a   George, Steven M ^a,b   McLean, Robert S ^c   Carcia, Peter F ^c  

^a UNIVERSITY OF COLORADO   (United States)

^b UCB 450   (United States)

^c DUPONT COMPANY   (United States)

Author keywords

Al2O3; alucone; atomic layer deposition; molecular layer deposition; Teflon; thermal stress

Indexed keywords

ALUCONE; CRACK DENSITY; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; FLUORINATED ETHYLENE PROPYLENE; INTERLAYER THICKNESS; MOLECULAR LAYER DEPOSITION; MOLECULAR LAYER DEPOSITIONS (MLD); RESIDUAL COMPRESSIVE STRESS; ROOM TEMPERATURE; TEFLON FEP; TEFLON SUBSTRATE; THERMAL EXPANSION MISMATCH; TRIMETHYLALUMINUM;

ALUMINUM; ALUMINUM COATINGS; ATOMIC LAYER DEPOSITION; COMPOSITE FILMS; COMPRESSIVE STRESS; CRACKS; DEPOSITS; ETHYLENE GLYCOL; FIELD EMISSION MICROSCOPES; FILM THICKNESS; POLYTETRAFLUOROETHYLENES; THERMAL EXPANSION; THERMAL STRESS;

SUBSTRATES;

EID: 84873659686     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am303077x     Document Type: Article

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