Applications of plasma technology in development of superhydrophobic surfaces

Plasma Chemistry and Plasma Processing

Volumn 33, Issue 1, 2013, Pages 177-200

  Jafari, Reza ^a   Asadollahi, Siavash ^a   Farzaneh, Masoud ^a  

^a UNIVERSITÉ DU QUÉBEC À CHICOUTIMI   (Canada)

Author keywords

Etching; Nano structured surfaces; Plasma polymerization; Sputtering; Superhydrophobic surfaces; Thin films

Indexed keywords

ADHESION IMPROVEMENT; ANTI-CORROSION COATING; ANTIFOULING SURFACES; BIOMEDICAL COATINGS; LOW ADHESION; NANOSTRUCTURED SURFACE; PLASMA TECHNOLOGY; POWER NETWORK MANAGEMENT; REACTIVE PLASMA SPECIES; SUPER-HYDROPHOBIC SURFACES; SUPERHYDROPHOBICITY; SURFACE ACTIVATION; SURFACE TREATMENT TECHNOLOGY; VARIOUS SUBSTRATES; WATER CONTACT ANGLE; WATER DROPLETS;

ADHESION; COATINGS; CONTACT ANGLE; ETCHING; HYDROPHOBICITY; NETWORK MANAGEMENT; PLASMA POLYMERIZATION; PLASMAS; SPUTTERING; SURFACE CLEANING; SURFACE PROPERTIES; TECHNOLOGY; TEXTILE INDUSTRY; THIN FILMS;

PLASMA APPLICATIONS;

EID: 84873409522     PISSN: 02724324     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11090-012-9413-9     Document Type: Article

References (149)

1. Shirtcliffe NJ, McHale G, Newton MI (2011) J Polym Sci Part B Polym Phys 49(17):1203-1217
2. Barthlott W, Neinhuis C, Schott CL (1997) Planta 202(1):1-8
3. Guo Z, Liu W, Su B-L (2011) J Colloid Interface Sci 353(2):335-55
4. Farzaneh M, Sarkar DK (2008) J CPRI 4(2):135-147
5. Guo Z, Liu W (2007) Plant Sci 172(6):1103-1112
6. Guo Z, Liu W, Su B-L (2008) Appl Phys Lett 93(20):201909
7. Dettre R, Johnson R (1963) J Phys Chem 107(43):1744-1750
8. Ma J, Sun Y, Gleichauf K, Lou J, Li Q (2011) Langmuir 27(16):10035-10040
9. Yan Y, Gao N, Barthlott W (2011) Adv Colloid Interface Sci 169(2):80-105
10. Li X-M, Reinhoudt D, Crego-Calama M (2007) Chem Soc Rev 36(8):1350-1368
11. Kale KH, Palaskar S (2010) Text Res J 81(6):608-620
12. Kim SH, Kim J-H, Kang B-K, Uhm HS (2005) Langmuir 21(26):12213-12217
13. Zhang J, France P, Radomyselskiy A, Datta S, Zhao J, vanOoij W (2003) J Appl Polym Sci 88(6):1473-1481
14. Ma M, Hill RM (2006) Curr Opin Colloid Interface Sci 11(4):193-202
15. Yao X, Song Y, Jiang L (2011) Adv Mater 23(6):719-734
16. Alizadeh A, Yamada M, Li R, Shang W, Otta S, Zhong S, Ge L, Dhinojwala A, Conway KR, Bahadur V, Vinciquerra aJ, Stephens B, Blohm ML (2012) Langmuir 28(6):3180-3186
17. Farzaneh M, Volat C (2008) Atmospheric Icing of power networks chapter anti-icing. Springer, Berlin, pp 229-268
18. Jafari R, Menini R, Farzaneh M (2010) Appl Surf Sci 257(5):1540-1543
19. Jafari R, Mobarakeh LF, Farzaneh M (2012) Nanosci Nanotechnol Lett 4(3):369-374
20. Lim H, Jung D-H, Noh J-H, Choi G-R, Kim W-D (2009) Chin Sci Bull 54(19):3613-3616
21. Palumbo F, Di Mundo R, Cappelluti D, D'Agostino R (2011) Plasma Process Polym 8:118-126
22. Marmur A (2003) Langmuir 19(2):8343-8348
23. Genzer J, Efimenko K (2006) Biofouling 22(5-6):339-360
24. Wang S, Feng L, Jiang L (2006) Adv Mater 18(6):767-770
25. Hermelin E, Petitjean J, Lacroix J-c, Chane-ching KI, Tanguy J, Lacaze P-c, De R (2008) Chem Mater 146(9):4447-4456
26. Zhang F, Zhao L, Chen H, Xu S, Evans DG, Duan X (2008) Angew Chem Int Ed 47(13):2466-2469
27. Hoefnagels HF, Wu D, deWith G, Ming W (2007) Langmuir 23(26):13158-13163
28. Huang F, Wei Q, Xu W, Li Q (2007) Surf Rev Lett 14(4):547-551
29. Zhang X, Jin M, Liu Z, Tryk D, Nishimoto S, Murakami T, Fujishima A (2007) J Phys Chem C 111(39):14521-14529
30. Boscher ND, Choquet P, Duday D, Verdier S (2010) Surf Coat Technol 205(7):2438-2448
31. Hosono E, Fujihara S, Honma I, Zhou H (2005) J Am Chem Soc 127(39):13458-13459
32. Zhang X, Shi F, Yu X, Liu H, Fu Y, Wang Z, Jiang L, Li X (2004) J Am Chem Soc 126(10):3064-3065
33. Buck ME, Schwartz SC, Lynn DM (2010) Chem Mater 22(23):6319-6327
34. Ofir Y, Samanta B, Arumugam P, Rotello VM (2007) Adv Mater 19(22):4075-4079
35. Ramaratnam K, Tsyalkovsky V, Klep V, Luzinov I (2007) Chem Commun 43:4510-4512
36. Zhai L, Fevzi C, Cohen RE, Rubner MF (2004) Nano Lett 4(7):17-19
37. Zhang X, Kono H, Liu Z, Nishimoto S, Tryk Da, Murakami T, Sakai H, Abe M, Fujishima A (2007) Chem Commun 46:4949
38. Young T (1805) Phil Trans R Soc Lond 95:609-612
39. Jafari R, Farzaneh M (2010) Appl Phys A Mater Sci Process 102(1):195-199
40. Ogihara H, Katayama T, Saji T (2011) J Colloid Interface Sci 362(2):560-566
41. Wenzel RN (1936) J Ind Eng Chem 28(8):988-994
42. Barshilia HC, Rajam K (2011) Nanosci Nanotechnol Lett 3(3):300-305
43. Carre A, Mittal K (2009) Superhydrophobic surfaces. Koninklije Brill NV, Leiden
44. Cassie ABD, Baxter S (1944) Trans Faraday Soc 40:546-551
45. Xia YE, Ming Z, Da-lin J, Jian LI, Lan CAI (2010) J Cent S Univ Technol 17:554-559
46. Brown PS, Berson A, Talbot EL, Wood TJ, Schofield WCE, Bain CD, Badyal JPS (2011) Langmuir 27(22):13897-13903
47. Ishino C, Okumura K (2008) Eur Phys J E 25(4):415-424
48. Ishino C, Okumura K, Quere D (2004) Europhys Lett 68(3):419-425
49. Patankar Na (2004) Langmuir 20(17):7097-102
50. Bormashenko E, Grynyov R (2012) Colloids Surf B 92:367-371
51. Wolansky G, Marmur A (1999) Colloids Surf A 156(1-3):381-388
52. Brandon S, Haimovich N, Yeger E, Marmur A (2003) J Colloid Interface Sci 263(1):237-243
53. Strobel M, Lyons CS (2011) Plasma Process Polym 8(1):8-13
54. Kietzig A-M (2011) Plasma Process Polym 8(11):1003-1009
55. Müller M, Oehr C (2011) Plasma Process Polym 8(1):19-24
56. Clifton B (1982) J Fluid Mech 118:27-40
57. Tadmor R (2004) Langmuir 20(18):7659-7664
58. Montes Ruiz-Cabello FJ, Rodríguez-Valverde MA, Cabrerizo-Vílchez Ma (2011) Plasma Process Polym 8(5):363-366
59. Mundo RD, Palumbo F, D'Agostino R (2008) Langmuir 24(9):5044-5051
60. Chen W, Fadeev AY, Hsieh MC, Öner D, Youngblood J, McCarthy TJ (1999) Langmuir 15(10):3395-3399
61. Balu B, Breedveld V, Hess DW (2008) Langmuir 24(9):4785-4790
62. Favia P, Cicala G, Milella A, Palumbo F, Rossini P, DAgostino R (2003) Surf Coat Technol 169-170:609-612
63. Saraf R, Lee HJ, Michielsen S, Owens J, Willis C, Stone C, Wilusz E (2011) J Mater Sci 46(17):5751-5760
64. Tendero C, Tixier C, Tristant P, Desmaison J, Leprince P (2006) Spectrochem Acta Part A 61(1):2-30
65. Grill A (1994) Cold plasma in materials fabrication: from fundamentals to applications. IEEE Press, New York
66. Weltmann KD, Kindel E, vonWoedtke T, Hähnel M, Stieber M, Brandenburg R (2010) Pure Appl Chem 82(6):1223-1237
67. Weltmann K-D, Kindel E, Brandenburg R, Meyer C, Bussiahn R, Wilke C, vonWoedtke T (2009) Contrib Plasma Phys. 49(9):631-640
68. Amanatides E, Mataras D (2007) Modeling and diagnostics of He discharges for treatment of polymers. In: D'Agostino R, Favia P, Kawai Y, Ikegami H, Sato N, Arefi-khonsari F (eds) Advanced plasma technology. Wiley-VCH, London, pp 55-74
69. Chu PK, Qin S, Chan C, Cheung NW, Larson LA (1996) Mater Sci Eng 17(6-7):207-280
70. Dave PN, Joshi AK (2010) J Sci Ind Res 69(3):177-179
71. Chattopadhyay R (2004) Advanced thermally assisted surface engineering processes. Kluwer, Dordrecht
72. Ohmori A, Hirano S (1993) J Therm Spray Technol 2(June):137-144
73. Horrocks AR, Nazaré S, Masood R, Kandola B, Price D (2011) Polym Adv Technol 22(1):22-29
74. Chapman B (1980) Glow discharge processes. Wiley, New York
75. Ellinas K, Tserepi a, Gogolides E (2011) Langmuir 27(7):3960-3969
76. Park J, Lim H, Kim W, Ko JS (2011) J Colloid Interface Sci 360(1):272-279
77. Takahashi T, Hirano Y, Takasawa Y, Gowa T, Fukutake N, Oshima A, Tagawa S, Washio M (2011) Radiat Phys Chem 80(2):253-256
78. Han Y, Manolach SO, Denes F, Rowell RM (2011) Carbohydr Polym 86(2):1031-1037
79. Cortese B, Morgan H (2012) Langmuir 28(1):896-904
80. Lacroix L-M, Ceriotti L, Kormunda M, Meziani T, Colpo P (2005) Surf Sci 592(1-3):182-188
81. Milella A, Di Mundo R, Palumbo F, Favia P, Fracassi F, D'Agostino R (2009) Plasma Process Polym 6(6-7):460-466
82. Wohlfart E, Fernandez-Blazquez JP, Arzt E, Del Campo A (2011) Plasma Process Polym 8(9):876-884
83. Fernández-Blázquez JP, Fell D, Bonaccurso E, delCampo A (2011) J Colloid Interface Sci 357(1):234-238
84. Teshima K, Sugimura H, Inoue Y, Takai O, Takano A (2005) Appl Surf Sci 244(1-4):619-622
85. Carbone E, Boucher N, Sferrazza M, Reniers F (2010) Surf Interface Anal 42(6-7):1014-1018
86. Chien H-H, Ma K-J, Yeh Y-P, Chao C-L (2011) In: Proceedings of 2011 international conference on electronic and mechanical engineering and information technology, pp 1215-1218
87. Vandencasteele N, Fairbrother H, Reniers F (2005) Plasma Process Polym 2(6):493-500
88. Vandencasteele N, Nisol B, Viville P, Lazzaroni R, Castner DG, Reniers F (2008) Plasma Process Polym 5(7):661-671
89. Fresnais J, Chapel J, Poncinepaillard F (2006) Surf Coat Technol 200(18-19):5296-5305
90. Lobo AO, Ramos SC, Antunes EF, Marciano FR, Trava-Airoldi VJ, Corat EJ (2012) Mater Lett 70:89-93
91. Siow KS, Britcher L, Kumar S, Griesser HJ (2006) Plasma Process Polym 3(6-7):392-418
92. Morent R, De Geyter N, Desmet T, Dubruel P, Leys C (2011) Plasma Process Polym 8(3):171-190
93. Woodward I, Schofield WCE, Roucoules V, Badyal JPS (2003) Langmuir 19(20):3432-3438
94. Woodward IS, Schofield WCE, Roucoules V, Bradley TJ, Badyal JPS (2006) Plasma Chem Plasma Process 26(5):507-516
95. Yasuda H (1985) Plasma polymerization. Academic Press, London
96. Os MTV (2000) Surface modification by plasma polymerization: film deposition, tailoring of surface properties and biocompatibility. Print Partners Ipskamp, Enschede
97. Gaur S, Vergason G (2000) In: society of vacuum coaters, 43rd annual technical conference proceedings, Society of Vacuum Coaters, Denver
98. Hegemann D, Hossain MM, Körner E, Balazs DJ (2007) Plasma Process Polym 4(3):229-238
99. Yasuda H, Matsuzawa Y (2005) Plasma Process Polym 2(6):507-512
100. Pulpytel J, Kumar V, Peng P, Micheli V, Laidani N, Arefi-Khonsari F (2011) Plasma Process Polym 8(7):664-675
101. Lommatzsch U, Ihde J (2009) Plasma Process Polym 6(10):642-648
102. Ward L, Schofield W, Badyal J, Goodwin A, Merlin P (2003) Langmuir 19(6):2110-2114
103. Teare DOH, Spanos CG, Ridley P, Kinmond EJ, Roucoules V, Badyal JPS, Brewer Sa, Coulson S, Willis C (2002) Chem Mater 14(11):4566-4571
104. Coulson SR, Woodward IS, Badyal JPS, Brewer Sa, Willis C (2000) Langmuir 16(15):6287-6293
105. Tedrow PK, Reif R (1994) Plasma-enhanced chemical vapor deposition. In: ASM metals handbook vol 5-surface engineering, pp 1524-1536
106. Hare E, Shafrin E, Zisman W (1954) J Phys Chem 58(3):236-239
107. Vandencasteele N, Reniers F (2010) J Electron Spectrosc Relat Phenom 178-179:394-408
108. Dutoit F, Sanderson R, Engelbrecht W, Wagener J (1995) J Fluorine Chem 74(1):43-48
109. Satyaprasad A, Jain V, Nema S (2007) Appl Surf Sci 253(12):5462-5466
110. Yang GH, Zhang Y, Kang ET, Neoh KG, Huan ACH, Lai DMY (2002) J Mater Sci 12(3):426-431
111. Zhang Y, Kang ET, Neoh KG, Huang W, Huan ACH, Zhang H, Lamb RN (2002) Polymer 43(26):7279-7288
112. Laguardia L, Ricci D, Vassallo E, Cremona A, Mesto E, Grezzi F, Dellera F (2007) Macromol Symp 247(1):295-302
113. Prat R, Koh YJ, Babukutty Y, Kogoma M, Okazaki S, Kodama M (2000) Polymer 41(20):7355-7360
114. Gonza R, Lo F, Navarro F, Da F, Ramos J (2009) J Appl Polym Sci 112(c):479-488
115. Bera PP, Francisco JS, Lee TJ (2010) In: Proceedings of the national academy of sciences of the United States of America 107(20):9049-9054
116. Steenland K, Fletcher T, Savitz Da (2010) Environ Health Perspect 118(8):1100-1108
117. Menini R, Farzaneh M (2009) Surf Coat Technol 203(14):1941-1946
118. Ji Y, Hong Y, Lee S, Kim S (2008) Surf Coat Technol 202(22-23):5663-5667
119. Favia P, Agostino R, Fracassi F, Chimica D, Bari U (1994) Plasma Surf Diagn 66(6):1373-1380
120. Inomata K, Ha H, Chaudhary KA, Koinuma H (1993) Appl Phys Lett 64(1):46-48
121. Costacurta S, Falcaro P, Vezzù S, Colasuonno M, Scopece P, Zanchetta E, Guglielmi M, Patelli A (2011) J Sol-Gel Sci Technol 60(3):340-346
122. Ji Y, Kim S, Kwon O, Lee S (2009) Appl Surf Sci 255(8):4575-4578
123. Shirtcliffe N, Thiemann P, Stratmann M, Grundmeier G (2001) Surf Coat Technol 142-144:1121-1128
124. Nogueira S, Tan IH, Furlan R, Brazil SP, Rico P (2006) Revista Brasileira de Aplicações de Vácuo 25(1):45-53
125. Rouessac V, Ungureanu A, Bangarda S, Deratani A, Lo C-H, Wei T-C, Lee K-R, Lai J-Y (2011) Chem Vap Depos 17(7-9):198-203
126. Siliprandi Ra, Zanini S, Grimoldi E, Fumagalli FS, Barni R, Riccardi C (2011) Plasma Chem Plasma Process 31(2):353-372
127. Foroughi Mobarakeh L, Jafari R, Farzaneh M (2011) Adv Mater Res 409:783-787
128. Cho SC, Hong YC, Cho SG, Ji YY, Han CS, Uhm HS (2009) Curr Appl Phys 9(6):1223-1226
129. Kim J-H, Liu G, Kim SH (2006) J Mater Sci 16(10):977
130. Sarkar DK, Farzaneh M, Paynter RW (2010) Appl Surf Sci 256(11):10-13
131. Aliev AD, Boinovich LB, Bukhovets VL, Emelyanenko AM, Gorbunov AM, Gorodetskii AE, Pashinin AS (2011) Nanotech Russ 6(11-12):723-732
132. Nisoa M, Wanichapichart P (2010) Songklanakrin J Sci Tech 32(1):97-101
133. Koshel D, Terreault B, Abel G, Ducharme P, Ross G, Savoie S (2002) Thin Solid Films 405(1-2):104-108
134. Wang D, Yang Q, Guo Y, Liu X, Shi J, Zhang J (2011) Mater Lett 65(15-16):2526-2529
135. Tomovska R, Daniloska V, Asua JM (2011) J Mater Sci 21(43):17492
136. Gan WY, Lam SW, Chiang K, Amal R, Zhao H, Brungs MP (2007) J Mater Sci 17(10):952
137. Borras A, Barranco A, González-Elipe AR (2008) Langmuir 24(15):8021-8026
138. Zhang J, Huang W, Han Y (2006) Langmuir 22(18):2946-2950
139. Li G, Chen T, Yan B, Ma Y, Zhang Z, Yu T, Shen Z, Chen H, Wu T (2008) Appl Phys Lett 92(17):173104
140. Zhou X, Guo X, Ding W, Chen Y (2008) Appl Surf Sci 255(5):3371-3374
141. Qi HJU, Fu YB, Wang D, Yang XX, Sui KY, Ma ZL (2000) Surf Coat Technol 131(1-3):177-180
142. Jaszewski R, Schifta H, Schnydera B, Schneuwlyb A, Gröningb P (1999) Appl Surf Sci 143(1-4):301-308
143. Golub Ma, Wydeven T, Johnson AL (1998) Langmuir 14(8):2217-2220
144. Biederman H, Zeuner M, Zalman J, Blkova P (2001) Thin Solid Films 392(2):208-213
145. Ryan ME, Fonseca LC, Tasker S, Badyal JPS (1995) J Phys Chem 99(18):7060-7064
146. Drábik M, Polonskyi O, Kylián O, Čechvala J, Artemenko A, Gordeev I, Choukourov A, Slav D (2010) Plasma Process 7(7):544-551
147. Kylián O, Drábik M, Polonskyi O, Čechvala J, Artemenko A, Gordeev I, Choukourov A, Matolínová I, Slavínská D, Biederman H (2011) Thin Solid Films 519(19):6426-6431
148. Stelmashuk V, Biederman H, Slavinska D, Zemek J, Trchova M (2005) Vacuum 77(2):131-137
149. Li G, Wang B, Liu Y, Tan T, Song X, Li E, Yan H (2008) Sci Technol Adv Mater 9(2):025006