Measuring methods for the investigation of in-plane and cross-plane thermal conductivity of thin films

Physica Status Solidi (A) Applications and Materials Science

Volumn 210, Issue 1, 2013, Pages 106-118

  Volklein F ^a   Reith, H ^a   Meier, A ^a  

^a RheinMain University of Applied Sciences Wiesbaden   (Germany)

Author keywords

measurement methods; MEMS; thermal conductivity; thin films

Indexed keywords

BULK VALUE; CONDUCTION MECHANISM; CRUCIAL PARAMETERS; DESIGN OPTIMIZATION; FILM PROPERTIES; INTEGRATED DEVICE; MEASUREMENT METHODS; MEASURING METHOD; RELIABLE SYSTEMS; SURFACE EFFECT; TECHNICAL APPLICATIONS; THIN FILM MATERIAL; TRANSIENT METHOD;

ASPECT RATIO; MEMS; OPTIMIZATION; THERMODYNAMIC PROPERTIES; THIN FILMS;

THERMAL CONDUCTIVITY;

EID: 84872404754     PISSN: 18626300     EISSN: 18626319     Source Type: Journal    
DOI: 10.1002/pssa.201228478     Document Type: Article

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