A new spatially rearranged bundle of mixed carbon nanotubes as VLSI interconnection

IEEE Transactions on Nanotechnology

Volumn 12, Issue 1, 2013, Pages 3-12

  Subash, Suraj ^a,b   Kolar, Jayanth ^a,c   Chowdhury, Masud H ^d  

^a UNIVERSITY OF ILLINOIS AT CHICAGO   (United States)

^b MICRON TECHNOLOGY INC   (United States)

^c AMAZON   (United States)

^d University of Illinois at Chicago   (United States)

Author keywords

Capacitive coupling; electromagnetic effect; mixed carbon nanotube (CNT) bundle; spatial CNT arrangement; very large scale integration (VLSI) interconnect

Indexed keywords

CAPACITIVE COUPLINGS; CAPACITIVE CROSSTALK; COMPREHENSIVE MODELING; DESIGN AND TECHNOLOGY; EMERGING APPLICATIONS; METAL WIRES; MIXED CARBON NANOTUBE (CNT) BUNDLE; NANO METER RANGE; NANOELECTRONIC CIRCUITS; ON-CHIP SIGNALS; PROCESSING CAPABILITY; SIGNAL LINES; SINGLE-WALL; SPATIAL CNT ARRANGEMENT; STRUCTURAL ARRANGEMENT; SWITCHING SPEED; VERY LARGE-SCALE INTEGRATION;

CROSSTALK; MAGNETOELECTRIC EFFECTS;

MULTIWALLED CARBON NANOTUBES (MWCN);

EID: 84872149396     PISSN: 1536125X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNANO.2011.2159014     Document Type: Article

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