메뉴 건너뛰기




Volumn 96, Issue 6, 2009, Pages 657-671

Mixed carbon nanotube bundles for interconnect applications

Author keywords

Carbon nanotube (CNT); CNT bundle; CNT capacitance; CNT inductance; CNT resistance; Mixed CNT bundle

Indexed keywords

CNT BUNDLE; CNT CAPACITANCE; CNT INDUCTANCE; CNT RESISTANCE; MIXED CNT BUNDLE;

EID: 70449602999     PISSN: 00207217     EISSN: 13623060     Source Type: Journal    
DOI: 10.1080/00207210902791702     Document Type: Article
Times cited : (24)

References (18)
  • 2
    • 33947235664 scopus 로고    scopus 로고
    • Are carbon nanotubes the future of VLSI interconnections?'
    • San Francisco, California, USA
    • Banerjee, K., and Srivastava, N. (2006), 'Are carbon nanotubes the future of VLSI interconnections?', in IEEE/ACM Design Automation Conference, San Francisco, California, USA, pp. 809-814.
    • (2006) IEEE/ACM Design Automation Conference , pp. 809-814
    • Banerjee, K.1    Srivastava, N.2
  • 3
    • 34547231310 scopus 로고    scopus 로고
    • A High Density, Carbon Nanotube Capacitor for Decoupling Applications'
    • New Orleans, Louisiana, USA
    • Budnik, M., Raychowdhury, A., Bansal, A., and Roy, K. (2006), 'A High Density, Carbon Nanotube Capacitor for Decoupling Applications', in 43rd ACM/IEEE Design Automation Conference, New Orleans, Louisiana, USA, pp. 935-938.
    • (2006) 43rd ACM/IEEE Design Automation Conference , pp. 935-938
    • Budnik, M.1    Raychowdhury, A.2    Bansal, A.3    Roy, K.4
  • 5
    • 0032606344 scopus 로고    scopus 로고
    • Carbon Nanotubes as Molecular Quantum Wires'
    • Dekker, C. (1999), 'Carbon Nanotubes as Molecular Quantum Wires', Physics Today, 52, 22-28.
    • (1999) Physics Today , vol.52 , pp. 22-28
    • Dekker, C.1
  • 6
    • 0035834415 scopus 로고    scopus 로고
    • Logic Gates and Computation from Assembled Nanowire Building Blocks
    • Huang, Y., Duan, X., Cui, Y., Lauhon, L.J., Kim, K.H., and Lieber, M. Ch. (2001), 'Logic Gates and Computation from Assembled Nanowire Building Blocks ', Science, 294, 1313-1317.
    • (2001) Science , vol.294 , pp. 1313-1317
    • Huang, Y.1    Duan, X.2    Cui, Y.3    Lauhon, L.J.4    Kim, K.H.5    Ch., L.M.6
  • 7
    • 33846330666 scopus 로고    scopus 로고
    • IBM to use DNA to shrink chip size. (last accessed 15 June 2008) International Technology Roadmap for Semiconductors
    • IBM to use DNA to shrink chip size. Hardware, Breaking Business and Technology News at silicon.com. http://hardware.silicon.com/storage/0,39024649, 39170121,00.htm (last accessed 15 June 2008).
    • (2005) Emerging Research Devices
  • 8
    • 33846330666 scopus 로고    scopus 로고
    • International Technology Roadmap for Semiconductors
    • International Technology Roadmap for Semiconductors (2005), Emerging Research Devices.
    • (2005) Emerging Research Devices
  • 10
    • 0000901446 scopus 로고    scopus 로고
    • Arrays for Multistage Complementary Logic and Ring Oscillators'
    • Arrays for Multistage Complementary Logic and Ring Oscillators', Nano Letters, 2, 929-932.
    • Nano Letters , vol.2 , pp. 929-932
  • 12
    • 70449578667 scopus 로고    scopus 로고
    • Single-Walled Carbon Nanotube Electronics'
    • Mceuen, P.L., Fuhrer, M., and Park, H. (2001), 'Single-Walled Carbon Nanotube Electronics', Applied Physics Letters, 1, 3693-3695.
    • (2001) Applied Physics Letters , vol.1 , pp. 3693-3695
    • McEuen, P.L.1    Fuhrer, M.2    Park, H.3
  • 13
    • 33947642463 scopus 로고    scopus 로고
    • Evaluating the Impact of Resistance in Carbon Nanotube Bundles for VLSI Interconnect using Diameter-Dependent Modelling Techniques
    • Nieuwoudt, A., and Massoud, Y. (2006), 'Evaluating the Impact of Resistance in Carbon Nanotube Bundles for VLSI Interconnect using Diameter-Dependent Modelling Techniques,' IEEE Transactions on Electron Devices, 53, 2460-2466.
    • (2006) IEEE Transactions on Electron Devices , vol.53 , pp. 2460-2466
    • Nieuwoudt, A.1    Massoud, Y.2
  • 14
  • 15
    • 31344449874 scopus 로고    scopus 로고
    • Modeling of Metallic Carbon Nanotube Interconnects for Circuit Simulations and a Comparison with Cu Interconnects for Scaled Technologies'
    • Raychowdhury, A., and Roy, K. (2006), 'Modeling of Metallic Carbon Nanotube Interconnects for Circuit Simulations and a Comparison with Cu Interconnects for Scaled Technologies', IEEE Transactions on Computer Aided Design, 25, 58-65.
    • (2006) IEEE Transactions on Computer Aided Design , vol.25 , pp. 58-65
    • Raychowdhury, A.1    Roy, K.2
  • 16
    • 70449560828 scopus 로고    scopus 로고
    • last accessed 20 December 2008
    • Sansiri, T., and Wang, W. (2007), 'CNT Bundle', https://www.nanohub.org/ tools/cnia/ (last accessed 20 December 2008)
    • (2007) 'Cnt Bundle'
    • Sansiri, T.1    Wang, W.2
  • 17
    • 33748630936 scopus 로고    scopus 로고
    • Performance Analysis of Carbon Nanotube Interconnects for VLSI applications'
    • Srivastava, N., and Banerjee, K. (2005), 'Performance Analysis of Carbon Nanotube Interconnects for VLSI applications', ICCAD, 383-390.
    • (2005) ICCAD , pp. 383-390
    • Srivastava, N.1    Banerjee, K.2
  • 18
    • 70449578666 scopus 로고    scopus 로고
    • UC Santa Barbara Press Release Last Accessed 18 June 2008
    • UC Santa Barbara, Press Release, 'Smart' Bio Nano tubes. http://www.ia.ucsb.edu/pa/ display.aspx?pkey=1325 (last accessed 18 June 2008).
    • Smart' Bio Nano Tubes


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.