Wetting and intermetallic study between Sn-3.5Ag-1.0Cu-xZn lead-free solders and copper substrate (x = 0, 0.1, 0.4, 0.7)

Advanced Materials Research

Volumn 501, Issue , 2012, Pages 150-154

  Mayappan, Ramani ^a  

^a UNIVERSITI TEKNOLOGI MARA   (Malaysia)

Author keywords

Intermetallic; Lead free solder; Sn Ag Cu; Wetting

Indexed keywords

COPPER SUBSTRATES; CU SUBSTRATE; INTERMETALLIC THICKNESS; LEAD FREE SOLDERS; SN-3.5AG; SN-AG-CU; SNPB SOLDER; SOLDER ALLOYS;

COPPER; ELECTRONICS INDUSTRY; INTERMETALLICS; LEAD; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; TECHNOLOGY; TIN ALLOYS; WETTING; ZINC;

TIN;

EID: 84860769288     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.501.150     Document Type: Conference Paper

References (10)

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