Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder

Advanced Materials Research

Volumn 277, Issue , 2011, Pages 106-111

  Mohd Salleh, Mohd Arif Anuar ^a   Hazizi, Muhammad Hafiz Zan ^a   Ahmad, Zainal Arifin ^b   Hussin, Kamarudin ^a   Ahmad, Khairel Rafezi ^a  

^a UNIVERSITY MALAYSIA PERLIS   (Malaysia)

^b SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

Author keywords

Composite; Electrical properties; Lead free solder; Mechanical properties; Wettability

Indexed keywords

COMPOSITE; CU-BASE ALLOY; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRICAL CONDUCTIVITY; LEAD FREE SOLDERS; LEAD-FREE; LEAD-FREE SOLDER; NANO-SIZE; NANOCOMPOSITE SOLDER;

ALLOYS; BLENDING; COPPER ALLOYS; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC PROPERTIES; FABRICATION; LEAD POWDER METALLURGY; MECHANICAL PROPERTIES; NANOCOMPOSITES; POWDER METALLURGY; SILICON NITRIDE; SILVER; SILVER ALLOYS; SINTERING; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 79960391322     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.277.106     Document Type: Article

References (11)

1. J.Shen, Y.C Chan (2009) Research advances in nano-composite solders. Microelectronics Reliability 49, 223-234.
2. L.C Tsao, S.Y Chang, C.I Lee, W.H. Sun, C.H Huang (2010) Effects of nano-Al2o3 Additions on microstructure development and hardness of Sn3.5Ag0.5Cu Solder. Elsevier Sciencedirect
3. Feng Tai, Fu Guo, Zhing-Dong Xia, Yong-ping Lei, Yao-wu Shi (2009) Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints. International Journal of Minerals, Metallurgy and Materials Vol 16. Pg 677.
4. XL Zhong and M.Gupta (2008) Development of lead-free Sn-0.7Cu/Al2O3 nanocomposite solders with superior strength. Journal of Physics 41.
5. S.M.L Nai, J.Wei, M.Gupta (2005) Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites. Thin Solid Films 504. Pg401-404.
6. Ramani Mayappan and Zainal Arifin Ahmad, (2010). "Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn-Zn lead-free solder", Intermetallic, Vol. 18: pp. 730-735.
7. Ramani Mayappan and Zainal arifin Ahmad, (2010). "Temperature and Flux Effect on Contact Angles and Intermetallic between Sn-8Zn-3Bi Lead-free Solder and Cu Substrate", Sains Malaysiana, Vol. 38 (3): 395-400.
8. Ramani Mayappan, A.B. Ismail, Z.A. Ahmad, T. Ariga and L.B. Hussain, (2007). "The effect of crosshead speed on the joint strength between Sn-Zn-Bi lead-free solders and Cu substrate". Journal of Alloys and Compounds. 436: 112-117 (Pubitemid 46550852)
9. Ramani Mayappan, A.B. Ismail, Z.A. Ahmad, T. Ariga and L.B. Hussain, (2006). "Effect of sample perimeter and temperature on Sn-Zn based lead-free solders". Materials Letters. 60: 2383-2389. (Pubitemid 43818150)
10. L.L Shaw, Z.G Yang, R.M Ren (1998) Synthesis of Nanostructured Si3N4/SiC Composite Powders Through High Energy Reaction Milling. Material Science and Engineering A244.pg 113-126. (Pubitemid 128412693)
11. M.Zhou, S.J Hu, H. Zhang (2000). "Critical specimen sizes for tensile-shear testing of steel sheets." University of Michigan Ann Arbor.