A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles

2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10

Volumn , Issue , 2010, Pages 49-53

  Lai, Huaxiang ^a   Lu, Xiuzhen ^a   Chen, Si ^a,b   Fu, Chune ^a,c   Liu, Johan ^a,d  

^a SHANGHAI UNIVERSITY   (China)

^b SMIT Ltd Co   (China)

^c SHT SMART HIGH TECH AB   (Sweden)

^d CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Electrical resistivity; Isotropic conductive adhesives (ICAs); Thermal conductivity

Indexed keywords

BONDING TEMPERATURES; CONDUCTIVE PROPERTIES; ELECTRICAL RESISTIVITY; ENVIRONMENTAL-FRIENDLY; HIGH TEMPERATURE; HIGHER RESOLUTION; ISOTROPIC CONDUCTIVE ADHESIVES; ISOTROPIC CONDUCTIVE ADHESIVES (ICAS); MATRIX; PACKAGING PROCESS; SEM IMAGE; SIC NANOPARTICLES;

ADHESIVES; BORON; BORON CARBIDE; BORON NITRIDE; ELECTRIC CONDUCTIVITY; NANOPARTICLES; NITRIDES; PACKAGING; PACKAGING MATERIALS; PEOPLE MOVERS; SILICON CARBIDE; THERMAL CONDUCTIVITY; THERMOANALYSIS;

SILVER;

EID: 77952398265     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2010.5441383     Document Type: Conference Paper

References (12)

1. Wolfson H, Elliott G, "Electrically conducting cements containing epoxy resins and silver," US Patent, US2774747, 1956.
2. James E Morris, Jeahuck Lee, et al, "An Ontology for Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications, " High Density Microsystem Design and Packaging and Component Failure Analysis, June. 2005, pp. 1-8.
3. Yi Li, C.P. Wong, "Recent advances of conductive adhesives as a lead-free alternative in electronic packaging : Materials, processing, reliability and applications," Materials Science and Engineering : R: Reports, vol.51, No.1-3 (2006), pp. 1-35.
4. James E. Morris, "Isotropic conductive adhesives: Future trends, possibilities and risks," Microelectronics Reliability, vol.24, No.2-3 (2007), pp. 328-330.
5. Irfan Mir, D. Kumar, "Recent advances in isotropic conductive adhesives for electronics packaging applications," International Journal of Adhesion & Adhesives, vol.28, No.7 (2008), PP. 362-371.
6. H.P. Wu, J.F. Liu, et al, "High conductivity of isotropic conductive adhesives filled with silver nanowires," International Journal of Adhesion & Adhesives Vol. 26, No.8 (2006), pp. 617-621.
7. M. Yamashita, K. Suganuma, "Improvement III high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers," Microelectronics Reliability, Vol.46, No,5-6 (2006), pp. 850-858.
8. Wen-Tung Cheng, Yu-Wen Chili, et al, "In situ fabrication of photo curable conductive adhesives with silver nano-particles in the absence of capping agent," International Journal of Adhesion & Adhesives, Vol.27, No.3 (2007), pp. 236-243.
9. C.F. Goh, H. Yu, "The effect of annealing on the morphologies and conductivities of sub-micrometer sized nickel particles used for electrically conductive adhesive," Thin Solid Films Vol.504, No.1-2 (2006), pp. 416 - 420.
10. Masahiro Inoue, K. Suganuma , "Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder," Soldering Surface Mount Technol., Vol.18, No.2 (2006), pp.40-45.
11. Masahiro Inoue, Hiroaki Muta, et aI, "Temperature Dependence of Electrical Resistivity of Isotropic Conductive Adhesive Composed of An Epoxy-based Binder," International Symposium on International Symposium on High Density Packaging and Microsystem Integration, Shanghai, China, June. 2007, pp. 110-113.
12. Masahiro Inoue, Hiroaki Muta, "Temperature Dependence of Electrical and Thermal Conductivities of an Epoxy-Based Isotropic Conductive Adhesive," Journal ofElectronic Materials, Vol.37, No.4 (2008), pp. 462-468.