Using soft lithography to fabricate gold nanoparticle patterns for bottom-gate field effect transistors

Thin Solid Films

Volumn 524, Issue , 2012, Pages 304-308

  Huang, Hui Ling ^a   Chen, Jem Kun ^b   Houng, Mau Phon ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Gold nanoparticles; Organic field effect transistors; Soft lithography

Indexed keywords

1 ,6-HEXANEDITHIOL; BOTTOM LAYERS; COLLOIDAL SOLUTIONS; CROSS LINKING AGENTS; DIRECT-PATTERNING; DRAIN-SOURCE CURRENTS; DRAIN-SOURCE VOLTAGE; ETCHING PROCESS; FABRICATE PATTERNS; GOLD NANOPARTICLE; GOLD NANOPARTICLES; INTEGRATED PROCESS; MULTIPLE LAYERS; NANO-SCALE PATTERNS; NANOSCALE METALS; OUTPUT CHARACTERISTICS; SELF-ASSEMBLING; SI SUBSTRATES; SI SURFACES; SOFT LITHOGRAPHY; SUBMICROMETERS; TRIMETHOXYSILANE; TWO PHASE SYSTEMS;

CROSSLINKING; GOLD; NANOTECHNOLOGY; ORGANIC FIELD EFFECT TRANSISTORS; PHOTOLITHOGRAPHY; SELF ASSEMBLED MONOLAYERS; SELF ASSEMBLY; SILICON;

METAL NANOPARTICLES;

EID: 84869504575     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2012.09.078     Document Type: Article

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