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Volumn 289, Issue 17-18, 2011, Pages 1829-1837
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Nanowires of 3-D cross-linked gold nanoparticle assemblies behave as thermosensors on silicon substrates
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Author keywords
Bottom up; Poly(AuNP); Thermosensor; Very large scale integration
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Indexed keywords
1 ,6-HEXANEDITHIOL;
BOTTOM LAYERS;
BOTTOM-UP;
DOT PATTERNS;
ELECTRICAL RESISTIVITY;
FABRICATION PROCESS;
GOLD NANOPARTICLE;
GOLD NANOPARTICLES;
MICRO WIRE;
MULTIPLE LAYERS;
NANO SCALE;
ORGANIC SHELLS;
OXYGEN PLASMA TREATMENTS;
POLY(AUNP);
ROOM TEMPERATURE;
SI SUBSTRATES;
SI SURFACES;
SI(100) SURFACE;
SILICON SUBSTRATES;
THERMO SENSORS;
THERMO-SENSOR;
THIOL GROUPS;
THREE-LAYER;
TWO PHASE SYSTEMS;
VERY-LARGE-SCALE INTEGRATION;
ELECTRON BEAMS;
GOLD;
NANOPARTICLES;
NANOWIRES;
PLASMA APPLICATIONS;
SUBSTRATES;
THREE DIMENSIONAL;
SILICON;
(3 MERCAPTOPROPYL)TRIOXYSILANE;
1,6 HEXANEDITHIOL;
GOLD NANOPARTICLE;
NANOWIRE;
SILANE;
SILICON;
THIOL;
UNCLASSIFIED DRUG;
ACCURACY;
ARTICLE;
CONTROLLED STUDY;
COVALENT BOND;
CROSS LINKING;
ELECTRON BEAM;
INTERMETHOD COMPARISON;
MOLECULAR DYNAMICS;
MOLECULAR ELECTRONICS;
MOLECULAR INTERACTION;
MOLECULAR WEIGHT;
NANOFABRICATION;
PARTICLE SIZE;
PHYSICAL CHEMISTRY;
PRIORITY JOURNAL;
PROCESS DEVELOPMENT;
PROCESS OPTIMIZATION;
SURFACE PROPERTY;
TEMPERATURE DEPENDENCE;
THERMORECEPTOR;
THREE DIMENSIONAL IMAGING;
TRANSMISSION ELECTRON MICROSCOPY;
VALIDATION PROCESS;
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EID: 84855187950
PISSN: 0303402X
EISSN: 14351536
Source Type: Journal
DOI: 10.1007/s00396-011-2503-z Document Type: Article |
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Times cited : (9)
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References (29)
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