Interfacial toughening of solution processed Ag nanoparticle thin films by organic residuals

Nanotechnology

Volumn 23, Issue 48, 2012, Pages

  Lee, Inhwa ^a   Kim, Sanghyeok ^a   Yun, Jeonghoon ^a   Park, Inkyu ^a   Kim, Taek Soo ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AG NANOPARTICLE; ANNEALING PROCESS; DOUBLE CANTILEVER BEAM; INTERFACIAL FRACTURE ENERGY; INTERFACIAL FRACTURE RESISTANCE; MECHANICAL DAMAGES; OPTIMIZED ANNEALING CONDITIONS; ORGANIC RESIDUALS; SILVER NANOPARTICLES; SOLUTION-PROCESSED; THERMAL-ANNEALING;

ANNEALING; FRACTURE ENERGY; NANOPARTICLES; THIN FILMS;

SILVER;

EID: 84869076256     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/23/48/485704     Document Type: Article

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