High temperature power electronics IGBT modules for electrical and hybrid vehicles

Proceedings - 2009 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2009

Volumn , Issue , 2009, Pages 199-204

  John, Reiner ^a   Vermesan, Ovidiu ^b   Bayerer, Reinhold ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b SINTEF   (Norway)

Author keywords

Electric vehicle; High temperature; Hybrid vehicle; IGBT; Power electronics

Indexed keywords

CIRCUIT CONFIGURATIONS; HIGH CURRENT APPLICATIONS; HIGH TEMPERATURE; HIGH TEMPERATURE CHARACTERISTICS; HIGH TEMPERATURE POWER ELECTRONICS; INTERMITTENT OPERATION; LOW SWITCHING FREQUENCY; PACKAGING TECHNOLOGIES;

BRIDGE CIRCUITS; CHIP SCALE PACKAGES; ELECTRIC VEHICLES; HYBRID VEHICLES; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); LEAKAGE CURRENTS; SEMICONDUCTOR JUNCTIONS;

POWER ELECTRONICS;

EID: 84867804568     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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