IGBT module failure analysis in railway applications

Microelectronics Reliability

Volumn 48, Issue 8-9, 2008, Pages 1427-1431

  Perpina X ^a   Serviere, J F ^b   Jorda X ^a   Fauquet, A ^a   Hidalgo, S ^a   Urresti Ibanez J ^a   Rebollo, J ^a   Mermet Guyennet, M ^b  

^a INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

^b ALSTOM   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE FILTERS; CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); QUALITY ASSURANCE; RAILROADS; RAILS; RELIABILITY; SAFETY FACTOR; SYNCHRONOUS MOTORS;

IGBT CHIPS; LATCH UPS; OVER CURRENTS; RAILWAY APPLICATIONS; SECONDARY BREAKDOWN;

FAILURE ANALYSIS;

EID: 50249184519     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.06.032     Document Type: Article

References (7)

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