메뉴 건너뛰기




Volumn 2002-January, Issue , 2002, Pages 896-902

Experimental characterization of material degradation of solder joint under fatigue loading

Author keywords

Electronic packaging thermal management; Fatigue; Interferometry; Isothermal processes; Joining materials; Soldering; Strain measurement; Testing; Thermal degradation; Thermal loading

Indexed keywords

CHARACTERIZATION; CONTINUUM DAMAGE MECHANICS; DROPS; ELASTIC MODULI; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FATIGUE TESTING; INTERFEROMETRY; ISOTHERMS; LOAD TESTING; MATERIALS TESTING; PACKAGING MATERIALS; PYROLYSIS; SOLDERED JOINTS; SOLDERING; STRAIN MEASUREMENT; TESTING; THERMAL CYCLING; THERMAL FATIGUE;

EID: 84867021072     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012550     Document Type: Conference Paper
Times cited : (3)

References (49)
  • 2
    • 0002411526 scopus 로고
    • A Mathematical Representation of the Multiaxial Bauschinger Effect
    • Armstrong, P. J. and Frederick, C. O., 1966, "A Mathematical Representation of the Multiaxial Bauschinger Effect", G.E.G.B. Report RD/B/N731
    • (1966) G.E.G.B. Report
    • Armstrong, P.J.1    Frederick, C.O.2
  • 3
    • 0032027467 scopus 로고    scopus 로고
    • Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept. Part I: Theory and formulation
    • Basaran, C., Desai, C.S., Kundu, T., 1998a, "Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept. Part I: Theory and formulation", J. Electronic Packag. 120 (1), pp41-47
    • (1998) J. Electronic Packag. , vol.120 , Issue.1 , pp. 41-47
    • Basaran, C.1    Desai, C.S.2    Kundu, T.3
  • 4
    • 0032028050 scopus 로고    scopus 로고
    • Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept. Part II: Verification and Application
    • Basaran, C., Desai, C.S., Kundu, T., 1998a, "Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept. Part II: Verification and Application", J. Electronic Packag. 120 (1), pp48-54
    • (1998) J. Electronic Packag. , vol.120 , Issue.1 , pp. 48-54
    • Basaran, C.1    Desai, C.S.2    Kundu, T.3
  • 5
    • 0032141340 scopus 로고    scopus 로고
    • Mechanics of Pb40/Sn60 Near-eutectic Solder Alloys Subjected to Vibration
    • Basaran, C., Chandaroy, R., 1998, "Mechanics of Pb40/Sn60 Near-eutectic Solder Alloys Subjected to Vibration", Applied Mathematical Modeling, Vol.22, pp601-627
    • (1998) Applied Mathematical Modeling , vol.22 , pp. 601-627
    • Basaran, C.1    Chandaroy, R.2
  • 6
    • 0032292877 scopus 로고    scopus 로고
    • A Thermodynamic Framework for Damage Mechanics of Solder Joints
    • Basaran, C., Yan, C., 1998, "A Thermodynamic Framework for Damage Mechanics of Solder Joints", Journal of Electronic Packaging, Trans. ASME, Vol.120, pp. 379-384.
    • (1998) Journal of Electronic Packaging, Trans. ASME , vol.120 , pp. 379-384
    • Basaran, C.1    Yan, C.2
  • 7
    • 0035603556 scopus 로고    scopus 로고
    • Selecting a Temperature Time History for Predicting Fatigue Life of Microelectronic Solder Joints
    • Basaran, C., Dishongh, T. and Zhao, Y., 2001, "Selecting a Temperature Time History for Predicting Fatigue Life of Microelectronic Solder Joints," Journal of Thermal Stresses, Vol. 24, No. 11, pp 1069-1085.
    • (2001) Journal of Thermal Stresses , vol.24 , Issue.11 , pp. 1069-1085
    • Basaran, C.1    Dishongh, T.2    Zhao, Y.3
  • 8
    • 0012042976 scopus 로고    scopus 로고
    • Measuring Intrinsic Modulus for Pb/Sn Solder Alloys
    • to appear
    • Basaran, C. and Jiang, J., "Measuring Intrinsic Modulus for Pb/Sn Solder Alloys," Mechanics of Materials, to appear.
    • Mechanics of Materials
    • Basaran, C.1    Jiang, J.2
  • 9
    • 40549090713 scopus 로고    scopus 로고
    • Grain Growth in Eutectic Pb/Sn Ball Grid Array Solder Joints
    • Basaran, C. and Wen,Y, "Grain Growth in Eutectic Pb/Sn Ball Grid Array Solder Joints", ITherm 2002 Conference.
    • ITherm 2002 Conference
    • Basaran, C.1    Wen, Y.2
  • 10
    • 0000687797 scopus 로고
    • Why Continuum Damage is Nonlocal: Micromechanics Arguments
    • ASCE
    • Bazant, Z. P., 1991, "Why Continuum Damage is Nonlocal: Micromechanics Arguments", Journal Engineering Mechanics, ASCE, Vol. 117, No. 5, pp. 1070-1087.
    • (1991) Journal Engineering Mechanics , vol.117 , Issue.5 , pp. 1070-1087
    • Bazant, Z.P.1
  • 11
    • 0032180495 scopus 로고    scopus 로고
    • The Mechanics of Size Dependent Indentation
    • Begley, M. and Hutchinson, J., 1998, "The Mechanics of Size Dependent Indentation", J. Mech. Phys. Solids, Vol. 46, No. 10, pp 2049-2068.
    • (1998) J. Mech. Phys. Solids , vol.46 , Issue.10 , pp. 2049-2068
    • Begley, M.1    Hutchinson, J.2
  • 12
    • 0030173970 scopus 로고    scopus 로고
    • Effect of the Specimen Size in Predicting the Mechanical Properties of PbSn Solder Alloys
    • Bonda, N.R. and Noyan. I. C., 1996, "Effect of the Specimen Size in Predicting the Mechanical Properties of PbSn Solder Alloys," Trans. Comp. Pack. and Manuf. Tech., A., 19 (2).
    • (1996) Trans. Comp. Pack. and Manuf. Tech., A. , vol.19 , Issue.2
    • Bonda, N.R.1    Noyan, I.C.2
  • 13
    • 0026888749 scopus 로고
    • A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints
    • Busso, E. P., Kitano, M., Kamazawa, 1992, "A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints", Journal of Engineering Materials and Technology, Vol. 114, pp. 331-337
    • (1992) Journal of Engineering Materials and Technology , vol.114 , pp. 331-337
    • Busso, E.P.1    Kitano, M.2    Kamazawa3
  • 14
    • 0024863669 scopus 로고
    • Constitutive Equations for Cyclic Plasticity and Viscoplasticity
    • Chaboche, J. L., 1989, "Constitutive Equations for Cyclic Plasticity and Viscoplasticity", International Journal of Plasticity, Vol. 5, pp. 247-302
    • (1989) International Journal of Plasticity , vol.5 , pp. 247-302
    • Chaboche, J.L.1
  • 16
    • 0032255136 scopus 로고    scopus 로고
    • Damage Mechanics Characterization on Fatigue Behavior of a Solder Joint Material
    • Anaheim, California
    • Chow, C.L., Yang, F., 1998, "Damage Mechanics Characterization on Fatigue Behavior of a Solder Joint Material", ASME international mechanical engineering congress & exposition, Anaheim, California, pp1-13
    • (1998) ASME International Mechanical Engineering Congress & Exposition , pp. 1-13
    • Chow, C.L.1    Yang, F.2
  • 17
    • 0001095959 scopus 로고
    • An Anisotropic Model of Damage Mechanics Based on Endochronic Theory of Plasticity
    • Chow, C. L., Chen, X. F., 1992, "An Anisotropic Model of Damage Mechanics Based on Endochronic Theory of Plasticity", Int. Journal of Fracture, Vol. 55, pp. 115-130.
    • (1992) Int. Journal of Fracture , vol.55 , pp. 115-130
    • Chow, C.L.1    Chen, X.F.2
  • 24
    • 0031250185 scopus 로고    scopus 로고
    • Thermodynamical Modeling of Elastic-Plastic Damage and Experimental Validation of Damage Potential
    • Hayakawa, K., Murakami, S., 1997, "Thermodynamical Modeling of Elastic-Plastic Damage and Experimental Validation of Damage Potential", Intl. J. of Damage Mechanics, Vol. 6, pp. 333-363.
    • (1997) Intl. J. of Damage Mechanics , vol.6 , pp. 333-363
    • Hayakawa, K.1    Murakami, S.2
  • 26
    • 0024876844 scopus 로고
    • On Energy-Based Coupled Elastoplastic Damage Theories: Constitutive Modeling and Computational Aspects
    • Ju, J. W., 1989, "On Energy-Based Coupled Elastoplastic Damage Theories: Constitutive Modeling and Computational Aspects,"International J. Solids Structures,Vol.25,No.7, pp.803-833
    • (1989) International J. Solids Structures , vol.25 , Issue.7 , pp. 803-833
    • Ju, J.W.1
  • 28
    • 0001723415 scopus 로고
    • Experimental Constitutive Relations for the High Temperature Deformation of a Pb-Sn Eutectic Alloy
    • Kashyap, P., Murty, G.S., 1981, "Experimental Constitutive Relations for the High Temperature Deformation of a Pb-Sn Eutectic Alloy", J. Mater. Sci. Eng. 50, 205-213.
    • (1981) J. Mater. Sci. Eng. , vol.50 , pp. 205-213
    • Kashyap, P.1    Murty, G.S.2
  • 32
    • 0024034012 scopus 로고
    • Mechanical Modeling of Material Damage
    • Murakami, S., 1988, "Mechanical Modeling of Material Damage," ASME Journal of Applied Mechanics, Vol. 55, pp.280-286.
    • (1988) ASME Journal of Applied Mechanics , vol.55 , pp. 280-286
    • Murakami, S.1
  • 34
    • 0348098805 scopus 로고    scopus 로고
    • A damage Coupling Framwork of Unified Viscoplasticity for the Fatigue of Solder Alloys
    • Qian, Z., Ren, W., Liu, S., 1999, "A damage Coupling Framwork of Unified Viscoplasticity for the Fatigue of Solder Alloys", J. Electronic Packag. Vol.21, pp162-168
    • (1999) J. Electronic Packag. , vol.21 , pp. 162-168
    • Qian, Z.1    Ren, W.2    Liu, S.3
  • 36
    • 0028710559 scopus 로고
    • A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints
    • Paydar, N., Tong, Y. and Akay, H. U., 1994, "A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints", Journal of Electronic Packaging, Vol. 116, pp. 265-273.
    • (1994) Journal of Electronic Packaging , vol.116 , pp. 265-273
    • Paydar, N.1    Tong, Y.2    Akay, H.U.3
  • 37
    • 0001724218 scopus 로고
    • Fundamental Problems in Visco-Plasticity
    • Academic Press, New York, NY
    • Robotnov, Y. N., 1969, "Fundamental Problems in Visco-Plasticity," in Recent Advances in Applied Mechanics, Academic Press, New York, NY.
    • (1969) Recent Advances in Applied Mechanics
    • Robotnov, Y.N.1
  • 42
    • 0022775159 scopus 로고
    • Creep, Strain-Rate-Sensitivity and Low Cycle Fatigue of 60/40 Solder
    • Solomon, H.D., 1986b. "Creep, Strain-Rate-Sensitivity and Low Cycle Fatigue of 60/40 Solder", Brazing and Soldering 11, 68-75.
    • (1986) Brazing and Soldering , vol.11 , pp. 68-75
    • Solomon, H.D.1
  • 44
    • 0030171903 scopus 로고    scopus 로고
    • Energy Approach to the Fatigue of 60/40 Solder: Part II-Influence of Hold Time and Asymmetric Loading
    • Solomon, H. D. and Tolksdorf, E. D., 1996, "Energy Approach to the Fatigue of 60/40 Solder: Part II-Influence of Hold Time and Asymmetric Loading.", ASME Journal of electronic packaging, Vol. 188, pp. 67-71.
    • (1996) ASME Journal of Electronic Packaging , vol.188 , pp. 67-71
    • Solomon, H.D.1    Tolksdorf, E.D.2
  • 46
    • 0000866130 scopus 로고    scopus 로고
    • Some Thoughts on Thermodynamics of Internal Variables
    • Valanis, K.C., 1997, "Some Thoughts on Thermodynamics of Internal Variables", Arch. Mech., Vol. 49, No. 2, pp. 443-445.
    • (1997) Arch. Mech. , vol.49 , Issue.2 , pp. 443-445
    • Valanis, K.C.1
  • 47
    • 0003324844 scopus 로고    scopus 로고
    • A Damage Cyclic Model for Metal Matrix Composites
    • Voyiadjis and Allen, eds., Elsevier, New York, NY
    • Voyiadjis, G. Z., and Thisgarajan, G., 1996, "A Damage Cyclic Model for Metal Matrix Composites", in Damage and Interface Debonding in Composites, Voyiadjis and Allen, eds., Elsevier, New York, NY.
    • (1996) Damage and Interface Debonding in Composites
    • Voyiadjis, G.Z.1    Thisgarajan, G.2
  • 49
    • 0034158821 scopus 로고    scopus 로고
    • Thermomechanical Behavior of Micron Scale Solder Joints under Dynamic Loads
    • Zhao,Y., Basaran, C., Cartwright, A., and Dishongh, T., 2000, "Thermomechanical Behavior of Micron Scale Solder Joints under Dynamic Loads", Mechanics of Materials, V32, n3, 161-173.
    • (2000) Mechanics of Materials , vol.32 , Issue.3 , pp. 161-173
    • Zhao, Y.1    Basaran, C.2    Cartwright, A.3    Dishongh, T.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.