-
1
-
-
70449100814
-
Reliability challenges for power devices under active cycling
-
Kanert W. Reliability challenges for power devices under active cycling. In: Proc 47th IRPS; 2009. p. 409-15.
-
(2009)
Proc 47th IRPS
, pp. 409-415
-
-
Kanert, W.1
-
2
-
-
80052632831
-
Dynamic lock-in thermography for operation-mode dependent thermally active fault localization
-
R. Schlangen Dynamic lock-in thermography for operation-mode dependent thermally active fault localization Microelectron Reliab 50 2010 1454 1458
-
(2010)
Microelectron Reliab
, vol.50
, pp. 1454-1458
-
-
Schlangen, R.1
-
3
-
-
84937111765
-
Measurement and simulation of self-heating in DMOS transistors up to very high temperatures
-
Pfost M, et al. Measurement and simulation of self-heating in DMOS transistors up to very high temperatures. In: Proc ISPSD; 2008. p. 209-12.
-
(2008)
Proc ISPSD
, pp. 209-212
-
-
Pfost, M.1
-
8
-
-
84866733783
-
-
MIL-STD-750. Method 1037
-
MIL-STD-750. Method 1037.
-
-
-
-
12
-
-
84866739313
-
-
IEC 60747-2, 9
-
IEC 60747-2, 9.
-
-
-
-
13
-
-
78651270392
-
Power cycling tests at high temperatures with IGBT power modules for hybrid electrical vehicle applications
-
Hensler A, et al. Power Cycling Tests at High Temperatures with IGBT Power Modules for Hybrid Electrical Vehicle Applications. In: ESTC; 2010.
-
(2010)
ESTC
-
-
Hensler, A.1
-
14
-
-
84866739395
-
Flexible active cycling stress testing of smart power switches
-
M. Glavanovics Flexible active cycling stress testing of smart power switches Microelectron Reliab 47 2007 1800 1804
-
(2007)
Microelectron Reliab
, vol.47
, pp. 1800-1804
-
-
Glavanovics, M.1
-
15
-
-
0030198137
-
Plastic-strain of aluminium interconnections during pulsed operation of IGBT multichip modules
-
M. Ciappa, and P. Malberti Plastic-strain of aluminium interconnections during pulsed operation of IGBT multichip modules Qual Rel Eng Int 12 1996 297 303
-
(1996)
Qual Rel Eng Int
, vol.12
, pp. 297-303
-
-
Ciappa, M.1
Malberti, P.2
-
16
-
-
17644395265
-
Fast thermal fatigue on top metal layer of power devices
-
S. Russo Fast thermal fatigue on top metal layer of power devices Microelectron Reliab 42 2002 1617 1622
-
(2002)
Microelectron Reliab
, vol.42
, pp. 1617-1622
-
-
Russo, S.1
-
17
-
-
80052916743
-
A reliable technology concept for active power cycling to extreme temperatures
-
M. Nelhiebel A reliable technology concept for active power cycling to extreme temperatures Microelectron Reliab 51 2011 1927 1932
-
(2011)
Microelectron Reliab
, vol.51
, pp. 1927-1932
-
-
Nelhiebel, M.1
-
18
-
-
80052916290
-
A study of the effect of degradation of the aluminium layer in the case of power semiconductor devices
-
S. Pietranico A study of the effect of degradation of the aluminium layer in the case of power semiconductor devices Microelectron Reliab 51 2011 1824 1829
-
(2011)
Microelectron Reliab
, vol.51
, pp. 1824-1829
-
-
Pietranico, S.1
-
19
-
-
80052955002
-
3D Electro-thermal modeling of bonding and metallization ageing effects for reliability improvement of power MOSFETs
-
T. Azoui 3D Electro-thermal modeling of bonding and metallization ageing effects for reliability improvement of power MOSFETs Microelectron Reliab 51 2011 1943 1947
-
(2011)
Microelectron Reliab
, vol.51
, pp. 1943-1947
-
-
Azoui, T.1
-
22
-
-
0001481981
-
Reliability of controlled collapse interconnections
-
K.C. Norris, and A.H. Landzberg Reliability of controlled collapse interconnections IBM J Res Dev 1969 266 271
-
(1969)
IBM J Res Dev
, pp. 266-271
-
-
Norris, K.C.1
Landzberg, A.H.2
-
23
-
-
84965008345
-
Model for Power Cycling lifetime of IGBT Modules - Various factors influencing lifetime
-
Bayerer R, et al. Model for Power Cycling lifetime of IGBT Modules - various factors influencing lifetime. In: CIPS; 2008.
-
(2008)
CIPS
-
-
Bayerer, R.1
-
24
-
-
24144456234
-
Lifetime prediction on the base of mission profiles
-
M. Ciappa Lifetime prediction on the base of mission profiles Microelectron Reliab 45 2005 1293 1298
-
(2005)
Microelectron Reliab
, vol.45
, pp. 1293-1298
-
-
Ciappa, M.1
-
25
-
-
33750615734
-
Bauschinger and size effects in thin-film plasticity
-
Y. Xiang, and I.J. Vlassak Bauschinger and size effects in thin-film plasticity Acta Mater 54 2006 5449 5460
-
(2006)
Acta Mater
, vol.54
, pp. 5449-5460
-
-
Xiang, Y.1
Vlassak, I.J.2
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