-
1
-
-
33645584226
-
Fiabilité des dispositifs semi-conducteurs de puissance-synergies de recherches entre applications automobiles et aéronautiques
-
15-16 mars Carry le Rouet (France)
-
Z. Khatir, G. Coquery, S. Lefebvre Fiabilité des dispositifs semi-conducteurs de puissance-synergies de recherches entre applications automobiles et aéronautiques, Proc of the 2 èmes Journées du RTP, 15-16 mars 2004, Carry le Rouet (France).
-
(2004)
Proc of the 2 Èmes Journées du RTP
-
-
Khatir, Z.1
Coquery, G.2
Lefebvre, S.3
-
2
-
-
33645595644
-
Reliability of lead free solder for high temperature appli-cations
-
15-16 mars Carry le Rouet (France)
-
Parmentier B. Reliability of lead free solder for high temperature appli-cations, Proc. of the 2 èmes Journées du RTP, 15-16 mars 2004, Carry le Rouet (France)
-
(2004)
Proc. of the 2 Èmes Journées du RTP
-
-
Parmentier, B.1
-
4
-
-
0033732440
-
Lifetime prediction of IGBT modules for traction applica-tions
-
M. Ciappa, and W. Fichtner Lifetime prediction of IGBT modules for traction applica-tions IEEE Int Reliab Physics Symp 38 2000 210
-
(2000)
IEEE Int Reliab Physics Symp
, vol.38
, pp. 210
-
-
Ciappa, M.1
Fichtner, W.2
-
5
-
-
3042769286
-
A Novel thermo-mechanics-based lifetime prediction model for cycle fatigue failure mechanisms in power semi-conductors
-
M. Ciappa, F. Carbognani, P. Cova, and W. Fichtner A Novel thermo-mechanics-based lifetime prediction model for cycle fatigue failure mechanisms in power semi-conductors IEEE Trans on Dev and Mat Reliability 3 2003 191 196
-
(2003)
IEEE Trans on Dev and Mat Reliability
, vol.3
, pp. 191-196
-
-
Ciappa, M.1
Carbognani, F.2
Cova, P.3
Fichtner, W.4
-
6
-
-
0035456914
-
Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter
-
G. Coquery, S. Carubelli, J.P. Ousten, R. Lallemand, F. Lecoq, D. Lhotellier, V. de Viry, and P. Dupuy Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter Microelectronics Reliability 41 2001 1695 1700
-
(2001)
Microelectronics Reliability
, vol.41
, pp. 1695-1700
-
-
Coquery, G.1
Carubelli, S.2
Ousten, J.P.3
Lallemand, R.4
Lecoq, F.5
Lhotellier, D.6
De Viry, V.7
Dupuy, P.8
-
7
-
-
0034999140
-
Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders
-
A. Schubert, H. Walter, R. Dudek, B. Michel, G. Lefranc, J. Otto, and G. Mitic Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders Proc of the 34th Int Symposium on Microelectronics IMAPS 2001
-
(2001)
Proc of the 34th Int Symposium on Microelectronics IMAPS
-
-
Schubert, A.1
Walter, H.2
Dudek, R.3
Michel, B.4
Lefranc, G.5
Otto, J.6
Mitic, G.7
-
9
-
-
2442544185
-
Compact and robust power electronic packaging inter-connection technology for an integrated starter generator
-
Expert, Essen
-
N. Seliger, J. Rackles, H. Schwarzenbauer, W. Kiffe, and S. Bolz, Compact and robust power electronic packaging inter-connection technology for an integrated starter generator, Haus der Technik Fachbuch Band 14, Expert, Essen 2002, pp. 248-255.
-
(2002)
Haus der Technik Fachbuch
, vol.14
, pp. 248-255
-
-
Seliger, N.1
Rackles, J.2
Schwarzenbauer, H.3
Kiffe, W.4
Bolz, S.5
-
10
-
-
33645586185
-
Überblick und Perspektiven des 14/42V Bordnetzes -Komponenten, Architektur und Möglichkeiten
-
VDI Gesellschaft Fahrzeug- Und Verkehrstechnik, Düsseldorf
-
R. Knorr, M. Bienert, S. Bolz, G. Lugert, and P. Skotzek Überblick und Perspektiven des 14/42V Bordnetzes -Komponenten, Architektur und Möglichkeiten Elektronik im Kraftfahrzeug, VDI Gesellschaft Fahrzeug- und Verkehrstechnik, Düsseldorf (2000)
-
(2000)
Elektronik im Kraftfahrzeug
-
-
Knorr, R.1
Bienert, M.2
Bolz, S.3
Lugert, G.4
Skotzek, P.5
-
11
-
-
0042512018
-
Reliable power electronics for automotive applica-tions
-
N. Seliger, E. Wolfgang, G. Lefranc, H. Berg, and T. Licht Reliable power electronics for automotive applica-tions Microelectronics Reliability 42 2002 1597 1604
-
(2002)
Microelectronics Reliability
, vol.42
, pp. 1597-1604
-
-
Seliger, N.1
Wolfgang, E.2
Lefranc, G.3
Berg, H.4
Licht, T.5
-
12
-
-
4944221172
-
A novel electro-thermal simulation approach of power IGBT modules for automotive traction applications
-
T. Kojima, Y. Yamada, M. Ciappa, M. Chiavarini, and W. Fichtner A novel electro-thermal simulation approach of power IGBT modules for automotive traction applications Proc. of the International Power Semiconductor Devices and ICs (ISPSD) 16 2004 289 292
-
(2004)
Proc. of the International Power Semiconductor Devices and ICs (ISPSD)
, vol.16
, pp. 289-292
-
-
Kojima, T.1
Yamada, Y.2
Ciappa, M.3
Chiavarini, M.4
Fichtner, W.5
-
13
-
-
0037766952
-
A novel thermomechanics-based lifetime prediction model for cycle fatigue failure mechanisms in power semicon-ductors
-
M. Ciappa, F. Carbognani, P. Cova, and W. Fichtner A novel thermomechanics-based lifetime prediction model for cycle fatigue failure mechanisms in power semicon-ductors Microelectronics Reliability 42 2002 1653 1658
-
(2002)
Microelectronics Reliability
, vol.42
, pp. 1653-1658
-
-
Ciappa, M.1
Carbognani, F.2
Cova, P.3
Fichtner, W.4
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