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Volumn 45, Issue 9-11, 2005, Pages 1293-1298

Lifetime prediction on the base of mission profiles

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; LARGE SCALE SYSTEMS; PROBLEM SOLVING; RELIABILITY; STRESSES;

EID: 24144456234     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.07.060     Document Type: Conference Paper
Times cited : (54)

References (14)
  • 1
    • 33645584226 scopus 로고    scopus 로고
    • Fiabilité des dispositifs semi-conducteurs de puissance-synergies de recherches entre applications automobiles et aéronautiques
    • 15-16 mars Carry le Rouet (France)
    • Z. Khatir, G. Coquery, S. Lefebvre Fiabilité des dispositifs semi-conducteurs de puissance-synergies de recherches entre applications automobiles et aéronautiques, Proc of the 2 èmes Journées du RTP, 15-16 mars 2004, Carry le Rouet (France).
    • (2004) Proc of the 2 Èmes Journées du RTP
    • Khatir, Z.1    Coquery, G.2    Lefebvre, S.3
  • 2
    • 33645595644 scopus 로고    scopus 로고
    • Reliability of lead free solder for high temperature appli-cations
    • 15-16 mars Carry le Rouet (France)
    • Parmentier B. Reliability of lead free solder for high temperature appli-cations, Proc. of the 2 èmes Journées du RTP, 15-16 mars 2004, Carry le Rouet (France)
    • (2004) Proc. of the 2 Èmes Journées du RTP
    • Parmentier, B.1
  • 4
    • 0033732440 scopus 로고    scopus 로고
    • Lifetime prediction of IGBT modules for traction applica-tions
    • M. Ciappa, and W. Fichtner Lifetime prediction of IGBT modules for traction applica-tions IEEE Int Reliab Physics Symp 38 2000 210
    • (2000) IEEE Int Reliab Physics Symp , vol.38 , pp. 210
    • Ciappa, M.1    Fichtner, W.2
  • 5
    • 3042769286 scopus 로고    scopus 로고
    • A Novel thermo-mechanics-based lifetime prediction model for cycle fatigue failure mechanisms in power semi-conductors
    • M. Ciappa, F. Carbognani, P. Cova, and W. Fichtner A Novel thermo-mechanics-based lifetime prediction model for cycle fatigue failure mechanisms in power semi-conductors IEEE Trans on Dev and Mat Reliability 3 2003 191 196
    • (2003) IEEE Trans on Dev and Mat Reliability , vol.3 , pp. 191-196
    • Ciappa, M.1    Carbognani, F.2    Cova, P.3    Fichtner, W.4
  • 9
    • 2442544185 scopus 로고    scopus 로고
    • Compact and robust power electronic packaging inter-connection technology for an integrated starter generator
    • Expert, Essen
    • N. Seliger, J. Rackles, H. Schwarzenbauer, W. Kiffe, and S. Bolz, Compact and robust power electronic packaging inter-connection technology for an integrated starter generator, Haus der Technik Fachbuch Band 14, Expert, Essen 2002, pp. 248-255.
    • (2002) Haus der Technik Fachbuch , vol.14 , pp. 248-255
    • Seliger, N.1    Rackles, J.2    Schwarzenbauer, H.3    Kiffe, W.4    Bolz, S.5
  • 10
    • 33645586185 scopus 로고    scopus 로고
    • Überblick und Perspektiven des 14/42V Bordnetzes -Komponenten, Architektur und Möglichkeiten
    • VDI Gesellschaft Fahrzeug- Und Verkehrstechnik, Düsseldorf
    • R. Knorr, M. Bienert, S. Bolz, G. Lugert, and P. Skotzek Überblick und Perspektiven des 14/42V Bordnetzes -Komponenten, Architektur und Möglichkeiten Elektronik im Kraftfahrzeug, VDI Gesellschaft Fahrzeug- und Verkehrstechnik, Düsseldorf (2000)
    • (2000) Elektronik im Kraftfahrzeug
    • Knorr, R.1    Bienert, M.2    Bolz, S.3    Lugert, G.4    Skotzek, P.5
  • 13
    • 0037766952 scopus 로고    scopus 로고
    • A novel thermomechanics-based lifetime prediction model for cycle fatigue failure mechanisms in power semicon-ductors
    • M. Ciappa, F. Carbognani, P. Cova, and W. Fichtner A novel thermomechanics-based lifetime prediction model for cycle fatigue failure mechanisms in power semicon-ductors Microelectronics Reliability 42 2002 1653 1658
    • (2002) Microelectronics Reliability , vol.42 , pp. 1653-1658
    • Ciappa, M.1    Carbognani, F.2    Cova, P.3    Fichtner, W.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.