Model for power cycling lifetime of IGBT Modules ? Various factors influencing lifetime

2008 5th International Conference on Integrated Power Systems, CIPS 2008

Volumn , Issue , 2008, Pages

  Bayerer, Reinhold ^a   Herrmann, Tobias ^b   Licht, Thomas ^a   Lutz, Josef ^b   Feller, Marco ^b  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING;

BLOCKING VOLTAGE; BONDING TECHNOLOGY; EMPIRICAL MODEL; JUNCTION TEMPERATURES; MULTIPLE REGRESSIONS; NUMBER OF CYCLES TO FAILURE; TEMPERATURE SWINGS; TEST CONDITION;

INSULATED GATE BIPOLAR TRANSISTORS (IGBT);

EID: 84965008345     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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