Fast thermal fatigue on top metal layer of power devices

Microelectronics Reliability

Volumn 42, Issue 9-11, 2002, Pages 1617-1622

  Russo, Sebastiano ^a   Letor, Romeo ^a   Viscuso, Orazio ^a   Torrisi, Lucia ^a   Vitali, Gianluigi ^a  

^a STMICROELECTRONICS   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

POWER MOSFET; TEMPERATURE; TEMPERATURE DISTRIBUTION;

AUTOMOTIVE APPLICATIONS; COFFIN-MANSON MODELS; LIFETIME PREDICTION; RADIOMETRIC TECHNIQUES; SCALING TECHNOLOGY; SHORT-CIRCUIT CONDITIONS; SURFACE METALLIZATION; TEMPERATURE VARIATION;

OUTAGES;

EID: 17644395265     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00200-7     Document Type: Conference Paper

References (2)

1. nd edition.Van Nostrand Reinhold.
2. Landzberg A.H., Norris K.C. Reliability of controlled collapse interconnections. IBM journal of research and development.