-
1
-
-
77954179935
-
The development of intelligent textiles at centexbel
-
Belly, M., Pirotte, F., & Catrysse, M. (2005). The development of intelligent textiles at centexbel. MST News, 2, S.44.
-
(2005)
MST News
, vol.2
, pp. 44
-
-
Belly, M.1
Pirotte, F.2
Catrysse, M.3
-
2
-
-
49249096890
-
Effects of fibre interactions on conductivity, within a knitted fabric stretch sensor
-
Bickerton, M. 2003. Effects of fibre interactions on conductivity, within a knitted fabric stretch sensor. IEEE Eurowearable, 67(September): S.67-S.72.
-
(2003)
IEEE Eurowearable
, vol.67
, Issue.September
, pp. 67-72
-
-
Bickerton, M.1
-
4
-
-
58149513274
-
Fabric PCBs, electronic sequins, and socket buttons: Techniques for E-textile craft
-
Buechley, L. and Eisenberg, M. 2007. Fabric PCBs, electronic sequins, and socket buttons: Techniques for E-textile craft. Journal of Personal and Ubiquitous Computing, 13: 133-150.
-
(2007)
Journal of Personal and Ubiquitous Computing
, vol.13
, pp. 133-150
-
-
Buechley, L.1
Eisenberg, M.2
-
5
-
-
6944235761
-
Woven fabric-based electrical circuits - part I: Evaluating interconnect methods
-
Dhawan, A., Seyam, A.M., Ghosh, T.K. and Muth, J.F. 2004. Woven fabric-based electrical circuits-part I: Evaluating interconnect methods. Textile Research Journal, 74(10): 913-918.
-
(2004)
Textile Research Journal
, vol.74
, Issue.10
, pp. 913-918
-
-
Dhawan, A.1
Seyam, A.M.2
Ghosh, T.K.3
Muth, J.F.4
-
6
-
-
84860894787
-
NCA Flip-Chip Bonding with Thermoplastic Elastomer Adhesives
-
December Paper presented at the IEEE 13th Electronics Packaging Technology Conference (EPTC 2011), Singapore
-
Foerster, P., Linz, T., von Krshiwoblozki, M., Walter, H., Kallmayer, C., & Aschenbrenner, R. (2011, December). NCA Flip-Chip Bonding with Thermoplastic Elastomer Adhesives. Paper presented at the IEEE 13th Electronics Packaging Technology Conference (EPTC 2011), Singapore.
-
(2011)
-
-
Foerster, P.1
Linz, T.2
von Krshiwoblozki, M.3
Walter, H.4
Kallmayer, C.5
Aschenbrenner, R.6
-
9
-
-
84866331582
-
-
International Organization for Standardization. (2000). ISO 6330:2000 - textiles - domestic washing and drying procedures for textile testing
-
International Organization for Standardization. (2000). ISO 6330:2000-textiles-domestic washing and drying procedures for textile testing.
-
-
-
-
10
-
-
84866331108
-
-
JEDEC Solid State Technology Association/Electronic Industry Association. (2005). JEDEC standard JESD22-A104-C temperature cycling
-
JEDEC Solid State Technology Association/Electronic Industry Association. (2005). JEDEC standard JESD22-A104-C temperature cycling.
-
-
-
-
11
-
-
84866317989
-
-
JEDEC Solid State Technology Association/Electronic Industry Association. (1997). JEDEC standard JESD22-A101-B steady state tempertare humidity bias life test - test method A101-B
-
JEDEC Solid State Technology Association/Electronic Industry Association. (1997). JEDEC standard JESD22-A101-B steady state tempertare humidity bias life test-test method A101-B.
-
-
-
-
12
-
-
0038350525
-
-
May Paper presented at the IEEE Electronic Components and Technology Conference, New Orleans
-
Kallmayer, C., Pisarek, R., Neudeck, A., Cichos, S., Gimpel, S., Aschenbrenner, R., & Reichl, H. (2003, May). New Assembly Technologies for Textile Transponder Systems. Paper presented at the IEEE Electronic Components and Technology Conference, New Orleans.
-
(2003)
New Assembly Technologies for Textile Transponder Systems
-
-
Kallmayer, C.1
Pisarek, R.2
Neudeck, A.3
Cichos, S.4
Gimpel, S.5
Aschenbrenner, R.6
Reichl, H.7
-
13
-
-
84866316042
-
-
In: Keil A., editors Berlin: Springer
-
Keil, A., Merl, W.A. and Vinaricky, E. 1984. Elektrische Kontakte und ihre Werkstoffe: Grundlagen, Werkstoffeigenschaften, Technologien, Anwendungen in der elektrischen Nachrichten- und Energietechnik [Electrical contacts and contact materials: Principals, material properties, technologies, applications in telecommunication engineering and power engineering], Edited by: Keil, A. Berlin: Springer.
-
(1984)
Elektrische Kontakte und ihre Werkstoffe: Grundlagen, Werkstoffeigenschaften, Technologien, Anwendungen in der elektrischen Nachrichten- und Energietechnik [Electrical contacts and contact materials: Principals, material properties, technologies, applications in telecommunication engineering and power engineering]
-
-
Keil, A.1
Merl, W.A.2
Vinaricky, E.3
-
14
-
-
77949275831
-
Electrical characterization of screen-printed circuits on the fabric
-
Kim, Y. and Kim, H.Y.-J. 2010. Electrical characterization of screen-printed circuits on the fabric. IEEE Transactions on Advanced Packaging, 33(1): S.196-S.205.
-
(2010)
IEEE Transactions on Advanced Packaging
, vol.33
, Issue.1
, pp. 196-205
-
-
Kim, Y.1
Kim, H.Y.-J.2
-
16
-
-
78651318742
-
-
September Paper presented at the 3rd Electronic System-integration Technology Conference (ESTC), Berlin, Germany
-
Linz, T., Simon, E., & Walter, H. (2010, September). Fundamental Analysis of Embroidered Contacts for Electronics in Textiles. Paper presented at the 3rd Electronic System-integration Technology Conference (ESTC), Berlin, Germany.
-
(2010)
Fundamental Analysis of Embroidered Contacts for Electronics in Textiles
-
-
Linz, T.1
Simon, E.2
Walter, H.3
-
17
-
-
62449201671
-
Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications
-
Durnten-Zurich: Trans Tech Publications Inc. Retrieved from
-
Linz, T., Vieroth, R., Dils, Ch., Koch, M., Braun, T., Becker, K.F., Kallmayer, Ch., & Hong, S.M. (2008). Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications. In Advances in science and technology (Vol. 60) (pp. 85-94). Durnten-Zurich: Trans Tech Publications Inc. Retrieved from, www.scientific.net/AST.60.85.
-
(2008)
Advances in science and technology
, vol.60
, pp. 85-94
-
-
Linz, T.1
Vieroth, R.2
Dils, C.3
Koch, M.4
Braun, T.5
Becker, K.F.6
Kallmayer, C.7
Hong, S.M.8
-
18
-
-
21044459040
-
Adhesion improvement of thermoplastic isotropically conductive adhesive
-
Liong, S., Wong, C. and Burgoyne, W.J. 2005. Adhesion improvement of thermoplastic isotropically conductive adhesive. IEEE Transactions on Components and Packaging Technologies, 28(2): 327-336.
-
(2005)
IEEE Transactions on Components and Packaging Technologies
, vol.28
, Issue.2
, pp. 327-336
-
-
Liong, S.1
Wong, C.2
Burgoyne, W.J.3
-
20
-
-
34548203099
-
Fundamental building blocks for circuits on textiles
-
Locher, I. and Tröster, G. 2007a. Fundamental building blocks for circuits on textiles. IEEE Transactions on Advanced Packaging, 30(3): S.541-S.550.
-
(2007)
IEEE Transactions on Advanced Packaging
, vol.30
, Issue.3
, pp. 541-550
-
-
Locher, I.1
Tröster, G.2
-
21
-
-
36948999392
-
Screen-printed textile transmission lines
-
Locher, I. and Tröster, G. 2007b. Screen-printed textile transmission lines. Textile Research Journal, 77(11): S.837-S.842.
-
(2007)
Textile Research Journal
, vol.77
, Issue.11
, pp. 837-842
-
-
Locher, I.1
Tröster, G.2
-
23
-
-
25844518552
-
A wearable health care system based on knitted integrated sensors
-
Paradiso, R., Loriga, G. and Taccini, N. 2005. A wearable health care system based on knitted integrated sensors. IEEE Transactions on Information Technology in Biomedicine, 9(3): S.337-S.344.
-
(2005)
IEEE Transactions on Information Technology in Biomedicine
, vol.9
, Issue.3
, pp. 337-344
-
-
Paradiso, R.1
Loriga, G.2
Taccini, N.3
-
26
-
-
84857522743
-
-
September Paper presented at the European Microelectronics Packaging Conference (EMPC), Brighton, UK
-
Simon, E.P., Kallmayer, C., Aschenbrenner, R., & Lang, K.D. (2011, September). Novel Approach for Integrating Electronics into Textiles at Room Temperature Using a Force-fit Interconnection. Paper presented at the European Microelectronics Packaging Conference (EMPC), Brighton, UK.
-
(2011)
Novel Approach for Integrating Electronics into Textiles at Room Temperature Using a Force-fit Interconnection
-
-
Simon, E.P.1
Kallmayer, C.2
Aschenbrenner, R.3
Lang, K.D.4
-
27
-
-
84866329828
-
-
June Paper presented at AUTEX 2007, Tampere, Finland
-
Sipilä, A., Kaasjager, A., Rotsch, C., & Linz, T. (2007, June). Integrating sEMG Sensors to Textile Materials. Paper presented at AUTEX 2007, Tampere, Finland.
-
(2007)
Integrating sEMG Sensors to Textile Materials
-
-
Sipilä, A.1
Kaasjager, A.2
Rotsch, C.3
Linz, T.4
-
28
-
-
27644508040
-
Moisture-induced failures of adhesive flip chip interconnects
-
Teh, L.K., Teo, M., Anto, E., Wong, C.C., Mhaisalkar, S.G., Teo, P.S. and Wong, E.H. 2005. Moisture-induced failures of adhesive flip chip interconnects. IEEE Transactions on Components and Packaging Technologies, 28(3): 506-516.
-
(2005)
IEEE Transactions on Components and Packaging Technologies
, vol.28
, Issue.3
, pp. 506-516
-
-
Teh, L.K.1
Teo, M.2
Anto, E.3
Wong, C.C.4
Mhaisalkar, S.G.5
Teo, P.S.6
Wong, E.H.7
-
29
-
-
67650542068
-
-
April Paper presented at the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-electronics and Micro-systems, EuroSimE 2009, Delft, The Netherlands
-
Walter, H., Dermitzaki, E., Shirangi, H., Wunderle, B., Hartmann, S., & Michel, B. (2009, April). Influence of Moisture on the Time and Temperature Dependent Properties of Polymer Systems. Paper presented at the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-electronics and Micro-systems, EuroSimE 2009, Delft, The Netherlands.
-
(2009)
Influence of Moisture on the Time and Temperature Dependent Properties of Polymer Systems
-
-
Walter, H.1
Dermitzaki, E.2
Shirangi, H.3
Wunderle, B.4
Hartmann, S.5
Michel, B.6
-
30
-
-
58149086678
-
-
September Paper presented at the 2nd Electronics System Integration Technology Conference, Greenwich, UK
-
Wunderle, B., Kallmayer, Ch., Walter, H., Braun, T., Michel, B., & Reichl, H. (2008, September). Reliability Modeling and Test for Flip-chip on Flex Substrates With Ag-filled Anisotropic Conductive Adhesive. Paper presented at the 2nd Electronics System Integration Technology Conference, Greenwich, UK.
-
(2008)
Reliability Modeling and Test for Flip-chip on Flex Substrates With Ag-filled Anisotropic Conductive Adhesive
-
-
Wunderle, B.1
Kallmayer, C.2
Walter, H.3
Braun, T.4
Michel, B.5
Reichl, H.6
-
31
-
-
0033352029
-
The contact resistance and reliability of anisotropically conductive film (ACF)
-
Yim, M.-J. and Paik, K.-W. 1999. The contact resistance and reliability of anisotropically conductive film (ACF). IEEE Transactions on Advanced Packaging, 22(2): S.166-S.173.
-
(1999)
IEEE Transactions on Advanced Packaging
, vol.22
, Issue.2
, pp. 166-173
-
-
Yim, M.-J.1
Paik, K.-W.2
|