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Volumn 60, Issue , 2008, Pages 85-94

Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications

Author keywords

Connectors; Electronics in textiles; Embroidered interconnections; Hot melt encapsulation; Packaging; Reliability standards and tests; Textile wiring and interconnections; Transfer molding

Indexed keywords

CONNECTORS (STRUCTURAL); INTELLIGENT MATERIALS; PACKAGING; RELIABILITY; SMART TEXTILES; TRANSFER MOLDING; WEARABLE TECHNOLOGY;

EID: 62449201671     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.4028/www.scientific.net/AST.60.85     Document Type: Conference Paper
Times cited : (70)

References (17)
  • 1
    • 33750814226 scopus 로고    scopus 로고
    • New Assembly Technologies for Textile Transponder Systems
    • New Orleans, May
    • C. Kallmayer et al., "New Assembly Technologies for Textile Transponder Systems", Electronic Components and Technology Conference, New Orleans, May 2003
    • (2003) Electronic Components and Technology Conference
    • Kallmayer, C.1
  • 2
    • 62449154164 scopus 로고    scopus 로고
    • Smart Fabrics, Interactive Textiles and Related Enabling Technologies: Market Opportunities and Requirements Analysis
    • Charleston, SC, USA, May
    • R. Al Mahfudh, C. Rezendes, "Smart Fabrics, Interactive Textiles and Related Enabling Technologies: Market Opportunities and Requirements Analysis", Intertech Pira smart fabrics Conference, Charleston, SC, USA, May 2008
    • (2008) Intertech Pira smart fabrics Conference
    • Al Mahfudh, R.1    Rezendes, C.2
  • 4
    • 62449128357 scopus 로고    scopus 로고
    • Untersuchung des Tragekomforts von Oberbekleidung mit verschiedenen elektronischen Modulen
    • September
    • C. Schuster "Untersuchung des Tragekomforts von Oberbekleidung mit verschiedenen elektronischen Modulen", Diplomarbeit, FHTW Berlin, September 2006
    • (2006) Diplomarbeit, FHTW Berlin
    • Schuster, C.1
  • 7
    • 62449302837 scopus 로고    scopus 로고
    • Personal communication with Jan Vanfleteren of CMST, Ghent University, May 2008
    • Personal communication with Jan Vanfleteren of CMST, Ghent University, May 2008
  • 8
    • 33845335200 scopus 로고    scopus 로고
    • Embroidering Electrical Interconnects with Conductive Yarn for the Integration of Flexible Electronic Modules into Fabric
    • Osaka, Japan, October
    • T. Linz, C. Kallmayer et al. "Embroidering Electrical Interconnects with Conductive Yarn for the Integration of Flexible Electronic Modules into Fabric", IEEE ISWC International Symposium on Wearable Computing, Osaka, Japan, October 2005
    • (2005) IEEE ISWC International Symposium on Wearable Computing
    • Linz, T.1    Kallmayer, C.2
  • 9
    • 62449173452 scopus 로고    scopus 로고
    • Personal communication with Anton Kaasjager from of TNO Science and Industry in Eindhoven, May 2008
    • Personal communication with Anton Kaasjager from of TNO Science and Industry in Eindhoven, May 2008
  • 10
    • 33750820384 scopus 로고    scopus 로고
    • Fully Integrated EKG Shirt based on Embroidered Electrical Interconnections with Conductive Yarn and Miniaturized Flexible Electronics
    • Cambridge, MA, USA, April
    • T. Linz, C. Kallmayer et al. "Fully Integrated EKG Shirt based on Embroidered Electrical Interconnections with Conductive Yarn and Miniaturized Flexible Electronics", IEEE BSN International Workshop on Wearable and Implantable Body Sensor Networks, Cambridge, MA, USA, April 2006
    • (2006) IEEE BSN International Workshop on Wearable and Implantable Body Sensor Networks
    • Linz, T.1    Kallmayer, C.2
  • 14
    • 0034508087 scopus 로고    scopus 로고
    • E-broidery: Design and fabrication of textile-based computing
    • Numbers &, May
    • E. R. Post, M. Orth, P. R. Russo, and N. Gershenfeld, "E-broidery: Design and fabrication of textile-based computing", IBM Systems Journal, Volume 39, Numbers 3 & 4, May 2000
    • (2000) IBM Systems Journal , vol.39 , pp. 3-4
    • Post, E.R.1    Orth, M.2    Russo, P.R.3    Gershenfeld, N.4
  • 15
    • 33750839888 scopus 로고    scopus 로고
    • New Interconnection Technologies for the Integration of Electronics on Textile Substrates
    • Tampere, Finland, September
    • T. Linz, C. Kallmayer et al., "New Interconnection Technologies for the Integration of Electronics on Textile Substrates", Ambience 2005, Tampere, Finland, September 2005
    • (2005) Ambience 2005
    • Linz, T.1    Kallmayer, C.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.