New assembly technologies for textile transponder systems

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1123-1126

  Kallmayer, Christine ^a   Pisarek, Rubin ^c   Neudeck, Andreas ^b   Cichos, Sven ^c   Gimpel, Sabine ^b   Aschenbrenner, Rolf ^a   Reichl, Herbert ^c  

^a FRAUNHOFER IZM   (Germany)

^b TITV Greiz ^*  (Germany)

^c TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; BAR CODES; CONDUCTIVE MATERIALS; ENCAPSULATION; FUNCTIONALLY GRADED MATERIALS; INTELLIGENT MATERIALS; LABELING; LABELS; MICROELECTRONICS; RELIABILITY; TEXTILES;

ELECTRICAL INTERCONNECTION; PASSIVE TRANSPONDER LABELS; SMART LABELS; TEXTILE BASED ANTENNAS; TEXTILE BASED ELECTRONIC MODULES; TEXTILE TRANSPONDER SYSTEMS;

TRANSPONDERS;

EID: 0038350525     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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8. A. Ostmann, J. Simon, H. Reichl "The Pretreatment of Aluminum Bondpads for Electroless Nickel Bumping", Proc. IEEE MCMC, Santa Cruz, 1993, pp. 74-78