Reliability modeling & test for flip-chip on flex substrates with Ag-filled anisotropic conductive adhesive

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 271-280

  Wunderle, B ^a   Kallmayer, C ^a   Walter, H ^a   Braun, T ^a   Michell, B ^a   Reichel, H ^b  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVE JOINTS; ANISOTROPY; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MECHANICAL PROPERTIES; MOISTURE; RELIABILITY; SILVER;

ANISOTROPIC CONDUCTIVE ADHESIVES; CHARACTERISATION; CHIP ON FLEXES; CONTACT PRESSURES; DIRECT PREDICTIONS; INTERCONNECT FAILURES; LIFETIME TESTS; LOADING PARAMETERS; MATERIAL ANALYSES; MEAN TIME TO FAILURES; PAPER ADDRESSES; PHYSICS OF FAILURES; QUANTITATIVE CHANGES; RELIABILITY MODELING; STRESS FIELDS; THERMO-MECHANICAL PROPERTIES;

QUALITY ASSURANCE;

EID: 58149086678     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684361     Document Type: Conference Paper

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