Novel approach for integrating electronics into textiles at room temperature using a force-fit interconnection

EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings

Volumn , Issue , 2011, Pages

  Simon, Erik P ^a   Kallmayer, Christine ^b   Aschenbrenner, Rolf ^b   Lang, Klaus Dieter ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

Conductive Yarn; Contact Resistance; Force Fit Interconnection; Smart Textiles

Indexed keywords

ALTERNATIVE METHODS; CONDUCTIVE LAYER; CONDUCTIVE YARNS; CONTACT FORCES; COST-EFFICIENT; CROSS-SECTION ANALYSIS; ELASTIC FORCE; ELECTRICAL CONNECTION; FORCE-FIT INTERCONNECTION; MEASURED DATA; MECHANICAL CONNECTIONS; ROOM TEMPERATURE; SMART TEXTILES; TEXTILE MATERIALS; THERMAL CYCLING TEST; TWO PLATES;

CONTACT RESISTANCE; ELECTRIC CONNECTORS; INTEGRATION; MICROELECTRONICS; STRIP TELECOMMUNICATION LINES; WOOL; YARN;

TEXTILES;

EID: 84857522743     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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