NCA flip-chip bonding with thermoplastic elastomer adhesives - Fundamental failure mechanisms and opportunities of polyurethane bonded NCA-interconnects

2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Volumn , Issue , 2011, Pages 223-230

  Foerster, Philipp ^a   Linz, Torsten ^a   Von Krshiwoblozki, Malte ^a   Walter, Hans ^a   Kallmayer, Christine ^a   Aschenbrenner, Rolf ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

electrical interconnection; flexible integration; NCA bonding; polyurethane; reliability; stress relaxation; thermoplastic (elastomers)

Indexed keywords

ACRYLIC ADHESIVES; ADHESIVE MATERIALS; COST-EFFICIENT; ELECTRICAL INTERCONNECTIONS; FAILURE MECHANISM; FLEXIBLE COMPONENTS; FLEXIBLE INTEGRATION; FLEXIBLE SUBSTRATE; FLIP CHIP ASSEMBLIES; FLIP-CHIP BONDING; HIGH AVAILABILITY; LONG TERM STABILITY; MASTER CURVE; MECHANICAL MOTIONS; ONE STEP; POLYURETHANE FILMS; TEMPERATURE CYCLING; THERMO-MECHANICAL BEHAVIORS; THERMOSETTING EPOXY;

ADHESION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTERCONNECTION NETWORKS; POLYURETHANES; RELIABILITY; STRESS RELAXATION; THERMOPLASTIC ELASTOMERS; THERMOSETS;

ADHESIVES;

EID: 84860894787     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2011.6184421     Document Type: Conference Paper

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