Study on melt properties, microstructure, tensile properties of low Ag content Sn-Ag-Zn Lead-free solders

Materials Science and Engineering: A

Volumn 556, Issue , 2012, Pages 885-890

  Luo, Tingbi ^a   Chen, Zhuo ^a   Hu, Anmin ^a   Li, Ming ^a  

^a Shanghai Jiao Tong University   (China)

Author keywords

Lead free solder; Melt properties; Microstructure; Sn Ag Zn; Tensile properties

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; LEAD ALLOYS; LEAD-FREE SOLDERS; SILVER; SILVER ALLOYS; TERNARY ALLOYS; TIN ALLOYS; ZINC; ZINC ALLOYS;

% REDUCTIONS; HIGH-STRENGTH; MELT PROPERTIES; OPTIMISATIONS; PAPER PROPERTIES; PROPERTY; SN-AG SOLDER; SN-AG-ZN; SNAGCU SOLDER; SNPB SOLDER;

MICROSTRUCTURE;

EID: 84865433049     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2012.07.086     Document Type: Article

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