High-Q inductors embedded in the fan-out area of an eWLB

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 8, 2012, Pages 1280-1292

  Wojnowski, MacIej ^a   Issakov, Vadim ^b   Knoblinger, Gerhard ^c   Pressel, Klaus ^a   Sommer, Grit ^a   Weigel, Robert ^d  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b IMEC   (Belgium)

^c INTEL CORPORATION   (United States)

^d UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

Microwave measurements; packaging; passive circuits; phase noise; thin film inductors; voltage controlled oscillators; wafer scale integration

Indexed keywords

CHIP TO PACKAGES; COMPLEMENTARY METAL OXIDE SEMICONDUCTORS; EMBEDDED INDUCTORS; FAN-OUT; HIGH FREQUENCY HF; HIGH QUALITY; HIGH-Q INDUCTORS; LC TANKS; MEASUREMENT RESULTS; ONCHIP INDUCTORS; OUTPUT POWER; PACKAGE DESIGNS; PACKAGE TECHNOLOGIES; PARASITIC CAPACITANCE; QUALITY FACTORS; REDISTRIBUTION LAYERS; SELF-RESONANCE FREQUENCY; SUBSTRATE LOSS; WAFER LEVEL; WAFER-SCALE INTEGRATION; WIRELESS APPLICATION;

CHIP SCALE PACKAGES; INTEGRATION; MICROWAVE MEASUREMENT; OSCILLISTORS; PACKAGING; PASSIVE NETWORKS; PHASE NOISE; VARIABLE FREQUENCY OSCILLATORS; WIRELESS TELECOMMUNICATION SYSTEMS; WSI CIRCUITS;

ELECTRIC INDUCTORS;

EID: 84864712595     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2186963     Document Type: Article

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