Embedded Wafer Level Ball grid array (eWLB) technology for system integration

2010 IEEE CPMT Symposium Japan, ICSJ10

Volumn , Issue , 2010, Pages

  Pressel, K ^a   Beer, G ^a   Meyer, T ^a   Wojnowski, M ^a   Fink, M ^a   Ofner, G ^a   Romer B ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED CMOS; EXCELLENT PERFORMANCE; FAN-OUT; HEAT DISSIPATION; INTERCONNECT DENSITIES; INTERCONNECT DESIGN; MM-WAVE APPLICATION; NEW MATERIAL; PACKAGING TECHNOLOGIES; SYSTEM IN PACKAGE; SYSTEM INTEGRATION; SYSTEM-ON-CHIP INTEGRATION; WAFER LEVEL; WAFER-LEVEL PACKAGING TECHNOLOGY; WARPAGES;

CMOS INTEGRATED CIRCUITS; MATERIALS PROPERTIES; MICROPROCESSOR CHIPS; PACKAGING; PROGRAMMABLE LOGIC CONTROLLERS; SILICON WAFERS; TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 79251550165     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CPMTSYMPJ.2010.5679657     Document Type: Conference Paper

References (7)

1. M. Brunnbauer, E. Fürgut, G. Beer, T. Meyer, H. Hedler, J. Belonio, E. Nomura, K. Kiuchi, K. Kobayashi, "An Embedded Device Technology Based on a Molded Reconfigured Wafer," 56th Electronic Components and Technology Conference, ECTC 2006, June 2006
2. M. Brunnbauer, E. Fürgut, G. Beer, T. Meyer, "Embedded Wafer Level Ball Grid Array (eWLB)," Electronics Packaging Technology Conference, EPTC 2007, Singapore, December 2007
3. T. Meyer et al., "Recent Developments in WLB and eWLB", SEMI Europe Stuttgart 2008, Advanced Packaging Conference
4. M. Wojnowski, M. Engl, M. Brunnbauer, K. Pressel, G. Sommer, R. Weigel, "High Frequency Characterization of Thin-Film RDL for Embedded Wafer Level BGA", Electronics Packaging Technology Conference, EPTC 2007, Singapore, December 2007
5. M. Wojnowski, M. Engl, B. Dehlink, G. Sommer, M. Brunnbauer, K. Pressel, R. Weigel, "A 77 GHz SiGe Mixer in an Embedded Wafer Level BGA Package", 58th Electronic Components and Technology Conference, ECTC 2008, June 2008
6. C. Geissler and A. Wolter, "A Novel Approach to SiP", SEMI Singapore 2010, Advanced Packaging Symposium
7. A. Wolter and C. Geissler, "How to realize reliable large packages", SEMI Singapore 2010, Advanced Packaging Symposium