High frequency characterization of thin-film redistribution layers for embedded wafer level BGA

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 308-314

  Wojnowski, M ^a   Engl, M ^a   Brunnbauer, M ^a   Pressel, K ^a   Sommer, G ^a   Weigel, R ^b  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BANDPASS FILTERS; CHIP SCALE PACKAGES; COPPER; ELECTRIC CURRENTS; ELECTRIC LINES; ELECTRONIC EQUIPMENT; ELECTRONICS PACKAGING; POWER TRANSMISSION; TECHNOLOGY; THIN FILM DEVICES; TRANSMISSION LINE THEORY;

BGA PACKAGES; CHARACTERISTIC IMPEDANCE; CHIP AREAS; COPLANAR TRANSMISSION LINES; COPPER METALLIZATION; EXTERNAL-; FAN-OUT; HIGH FREQUENCIES; HIGH-DENSITY; HIGH-FREQUENCY CHARACTERIZATION; HIGH-Q INDUCTORS; HIGH-Q PASSIVES; INDUCTANCE VALUES; INSERTION LOSSES; LOW LOSSES; MEASUREMENT RESULTS; PACKAGING TECHNOLOGIES; QUALITY FACTOR; SIP APPLICATIONS; TRANSMISSION LINES; WAFER LEVELS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50049126131     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469826     Document Type: Conference Paper

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