Embedded Wafer Level Ball Grid Array (eWLB)

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 994-998

  Meyer, T ^a   Ofner, G ^a   Bradl, S ^a   Brunnbauer, M ^a   Hagen, R ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILE ELECTRONIC EQUIPMENT; BALL GRID ARRAYS; DIES; ELECTRONIC EQUIPMENT MANUFACTURE; SOLDERING ALLOYS; SPHERES; STANDARDS; TECHNOLOGY; THIN FILM DEVICES;

BALL GRIDS; EMBEDDED WAFER LEVEL PACKAGES; ENVIRONMENTAL-FRIENDLY TECHNOLOGIES; FAN OUTS; INFINEON; INTERCONNECT DENSITIES; PACKAGING COSTS; PACKAGING TECHNOLOGIES; PLATFORM DEVELOPMENT; RELIABILITY TESTS; SMALL PACKAGES; STANDARD BALLS; SYSTEM INTEGRATIONS; TEST VEHICLES; THERMAL PERFORMANCE; THIN-FILM; THIN-FILM TECHNOLOGIES; WAFER LEVEL PACKAGES; WAFER LEVELS; WAFER-LEVEL PACKAGING;

CHIP SCALE PACKAGES;

EID: 63049131136     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763559     Document Type: Conference Paper

References (4)

1. J.-C. Souriau et al., "Wafer Level Processing of 3D System in Package for RF and Data Applications", ECTC 2005, Lake Buena Vista, Florida, p. 356
2. S.N. Towle et al., "Bump less Built-Up Layer Packaging", ASME International Mechanical Engineering Congress and Exposition (IMECE), November 12, 2001
3. D. Komatsu and T. Wakabayashi, "Trend of WLP Technology and Next Generation Packaging WLP and EWLP", 5th International Workshop on Microelectronics Assembly and Packaging & Reverse Trade Show, 2005, 15.-16. Sept. 2005, Fukuoka, Japan
4. M. Mangrum, "Packaging Technologies for Mobile Phones", Electronic Packaging Technology Conference ECTC 2006, Singapore, p. 96