Impact of isothermal aging on the long-term reliability of fine-pitch ball grid array packages with different Sn-Ag-Cu solder joints

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 8, 2012, Pages 1317-1327

  Zhang, Jiawei ^a   Thirugnanasambandam, Sivasubramanian ^a   Evans, John L ^a   Bozack, Michael J ^b   Sesek, Richard ^a  

^a AUBURN UNIVERSITY   (United States)

^b AUBURN UNIVERSITY   (United States)

Author keywords

Board finishes; isothermal aging; lead free; microstructure; reliability; SnAgCu; solder

Indexed keywords

AGING TEMPERATURES; BALL GRID ARRAY PACKAGES; BOARD FINISHES; CYCLE NUMBER; DELETERIOUS EFFECTS; DWELL TIME; ELEVATED TEMPERATURE; FINE-PITCH BALL GRID ARRAY PACKAGES; HIGH TEMPERATURE; ISOTHERMAL AGING; LEAD-FREE; PACKAGE SIZE; RELIABILITY PERFORMANCE; ROOM TEMPERATURE; SAC ALLOY; SN-3.0AG-0.5CU; SN-37PB; SNAGCU; SNAGCU SOLDER; SOLDER BALLS; WEIBULL ANALYSIS;

DEGRADATION; ISOTHERMS; LEAD; MICROSTRUCTURE; RELIABILITY; SILVER; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS;

TIN;

EID: 84864668318     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2198476     Document Type: Article

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