Effects of room temperature storage time on the shear strength of PBGA solder balls

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 2, Issue , 2002, Pages 259-262

  Lee, S W Ricky ^a   Tsui, Yat Kit ^a   Hunag, Xingjia ^a   Yan, Eric C C ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Aging effect; PBGA; Shear strength; Solder ball

Indexed keywords

AGING EFFECTS; PLASTIC BALL GRID ARRAYS (PBGA);

DEGRADATION; OPTICAL MICROSCOPY; SHEAR STRENGTH; SOLDERING; THERMAL EFFECTS;

ELECTRONICS PACKAGING;

EID: 0346971049     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2002-39514     Document Type: Conference Paper

References (8)

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2. Huang, X., S.W.R. Lee, C.C. Yan, and S. Hui (2001), "Characterization and Analysis on the Solder Ball Shear Testing Conditions," Proc. 51st Electronic Components and Technology Conference, Orlando, FL, pp. 1065-1071.
3. JEDEC (2000), "EGA Ball Shear," JEDEC Standard JESD22-B117, JEDEC Solid State Technology Association.
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