Isothermal aging effects on the mechanical shock performance of lead-free solder joints

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 5, 2011, Pages 714-721

  Ma, Hongtao ^a   Lee, Tae Kyu ^a   Kim, Dong Hyun ^a   Park, Han G ^b   Kim, Sang Ha ^b   Liu, Kuo Chuan ^a  

^a CISCO SYSTEMS   (United States)

^b NEC Corporation of America   (United States)

Author keywords

Aging effects; ball grid array packages; lead free solder joints; mechanical shock; pad cratering

Indexed keywords

AGING EFFECTS; BALL GRID ARRAY PACKAGES; LEAD-FREE SOLDER JOINT; MECHANICAL SHOCK; PAD CRATERING;

GEOMORPHOLOGY; INTERMETALLICS; ISOTHERMS; MECHANICAL PROPERTIES; MECHANISMS; TIN;

SOLDERED JOINTS;

EID: 84859805808     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2118757     Document Type: Article

References (13)

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