The thermal resistance of solder joints in high brightness light emitting diode (HB LED) packages

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 4, 2009, Pages 825-831

  Yoon, Young Bok ^a   Park, Jin Woo ^b  

^a Samsung Electro Mechanics   (South Korea)

^b Yonsei University   (South Korea)

Author keywords

Finite element method; LED package; Structure function; Thermal resistance

Indexed keywords

ANALYTICAL METHOD; AU-SN ALLOY; EUTECTIC SOLDERS; HEAT EXTRACTION; HIGH BRIGHTNESS; OPTICAL EFFICIENCY; PACKAGE STRUCTURE; SOLDER JOINTS; STRUCTURE FUNCTION; STRUCTURE FUNCTIONS; THERMAL RESISTANCE; TRANSIENT THERMAL MEASUREMENT;

GOLD; HEAT RESISTANCE; HYSTERESIS MOTORS; LIGHT EMISSION; LIGHT EMITTING DIODES; PACKAGING; PHYSICAL OPTICS; TIN; TIN ALLOYS;

FINITE ELEMENT METHOD;

EID: 72149101230     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2033414     Document Type: Article

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