Transient dual interface measurement - A new JEDEC standard for the measurement of the junction-to-case thermal resistance

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2011, Pages 222-229

  Schweitzer, Dirk ^a   Pape, Heinz ^a   Chen, Liu ^a   Kutscherauer, Rudolf ^a   Walder, Martin ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

JEDEC standard JESD51 14; Junction to case thermal resistance; power semiconductor device; transient dual interface measurement

Indexed keywords

COMPETITIVE ADVANTAGE; DATA-SHEET VALUES; HEAT FLOW PATH; INDUSTRY STANDARDS; JEDEC STANDARDS; JUNCTION-TO-CASE THERMAL RESISTANCE; POWER SEMICONDUCTOR DEVICE; POWER SEMICONDUCTOR DEVICES; POWER SEMICONDUCTORS; REPRODUCIBILITIES; SEMICONDUCTOR MANUFACTURERS; THERMAL CHARACTERISTICS; THERMAL RESISTANCE; TRANSIENT MEASUREMENT;

COMPETITION; POWER ELECTRONICS; SEMICONDUCTOR SWITCHES; STANDARDS; THERMAL VARIABLES MEASUREMENT; TRANSIENT ANALYSIS;

SEMICONDUCTOR JUNCTIONS;

EID: 79957656802     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2011.5767204     Document Type: Conference Paper

References (14)

1. MIL-STD-883G, United States Department of Defense Test Method Standard: Microcircuits, Method 1012.1 Thermal Characteristics, 1980.
2. Electronic Industries Association, Integrated Circuit Thermal Measurement Method - Electrical Test Method, EIA / JEDEC Standard, JESD51-1, 1995 [www.jedec.org].
3. B. Siegal, "An alternative approach to junction-to-case thermal resistance measurements", Electronics Cooling Magazine, Vol. 7, No. 2, pp. 52-57, 2001.
4. P. Szabo, O. Steffens, M. Lenz, and G. Farkas, "Transient junction-to-case thermal resistance measurement methodology of high accuracy and high repeatability", Proc. 10th THERMINIC, Sofia-Antipolis, pp. 145-150, 2004.
5. th SEMITHERM, San Jose, pp. 313-321, 2005.
6. Electronic Industries Association, "Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction-to-Case of Semiconductor Devices with Heat Flow Trough a Single Path", EIA / JEDEC Standard, JESD51-14, 2010 [www.jedec.org].
7. th THERMINIC, Rome, pp. 14-19, 2008.
8. th SEMITHERM, San Jose, pp. 172-179, 2009.
9. Dirk Schweitzer, "Transient Dual Interface Measurement of the Rth-JC of Power Semiconductor Packages", Electronics Cooling, Vol. 16, No. 3, pp. 14-19, 2010.
10. th SEMITHERM, San Jose, pp. 193-199, 2008.
11. Dirk Schweitzer, "TDIM-Master: Software for the Evaluation of Transient Dual Interface Measurements of the Rth-JC According to JEDEC Standard JESD51-14", Munich, 2010, available through www.jedec.org or upon request from the author.
12. M.Glavanovics, and M.Zitta, "Thermal Destruction Testing: An Indirect Approach to a Simple Dynamic Model of Smart Power Switches", Proc of ESSIRC, pp. 236-239, 2001.
13. C.J.M. Lasance, "Heat Spreading: Not a Trivial Problem", Electronics Cooling, Vol. 14, No. 2, pp. 24-30, 2008.
14. th SEMITHERM, Santa Clara, pp. 151-157, 2010.