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Volumn 44, Issue 8, 2012, Pages 938-941

XPS depth analysis of CuO by electrospray droplet impact

Author keywords

CuO; EDI; Electrospray Droplet Impact; XPS depth analysis

Indexed keywords

CUO; DEPTH ANALYSIS; ELECTROSPRAY DROPLETS; ETCHING RATE; ETCHING TECHNIQUE; EXPERIMENTAL CONDITIONS; ORGANIC MATERIALS; SELECTIVE ETCHING; SURFACE DAMAGES;

EID: 84864439729     PISSN: 01422421     EISSN: 10969918     Source Type: Journal    
DOI: 10.1002/sia.4843     Document Type: Conference Paper
Times cited : (46)

References (22)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.