Mechanical durability of RFID chip joints assembled on flexible substrates

Soldering and Surface Mount Technology

Volumn 24, Issue 3, 2012, Pages 206-215

  Janeczek, Kamil ^a   Serzysko, Tomasz ^a   Jakubowska, Malgorzata ^b,c   Koziol, Gražyna ^a   Mložniak, Anna ^b  

^a TELE AND RADIO RESEARCH INSTITUTE   (Poland)

^b ukasiewicz Research Network Institute of Microelectronics and Photonics   (Poland)

^c WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Additives; Carbon nanotubes; Chip assembly; CNT; Flexible substrate; Joining processes; Mechanical durability; Mechanical properties of materials; RFID; Stress (materials)

Indexed keywords

CHIP ASSEMBLY; CNT; FLEXIBLE SUBSTRATE; JOINING PROCESS; MECHANICAL DURABILITY; MECHANICAL PROPERTIES OF MATERIALS; STRESS(MATERIALS);

ABILITY TESTING; ADDITIVES; ANTENNAS; ASSEMBLY; CARBON NANOTUBES; CONDUCTIVE MATERIALS; CURING; MELTING; PRINTING; RADIO FREQUENCY IDENTIFICATION (RFID); STRESSES; SUBSTRATES;

DURABILITY;

EID: 84863901115     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911211240074     Document Type: Article

References (22)

1. Blayo, A. and Pineaux, B. (2005), "Printing processes and their potential for RFID printing", Proc. of the 2005 Joint Conference on Smart Objects and Ambient Intelligence: Innovative Context-Aware Services: Usages and Technologies, Grenoble, pp. 27-30.
2. Cai, X.-H., An, B., Lai, X.-W., Wu, Y.-P. and Wu, F.-S. (2007), "Reliability evaluation on flexible RFID tag inlay packaged by anisotropic conductive adhesive", Proc. of 8th International Conference on Electronic Packaging Technology ICEPT 2007, Shanghai, pp. 1-4.
3. Cai, X.-H., Chen, X.C., An, B., Wu, F.X. and Wu, Y.P. (2009), "The effects of bonding parameters on the reliability performance of flexible RFID tag inlays packaged by anisotropic conductive adhesive", International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, pp. 1054-8.
4. Cheng, C.-M., O'hara, W., Xia, B. and Buffa, V. (2004), "Conductive adhesives for RFID assembly: low temperature snap cure thermoset adhesives", Proc. of International Symp. on Microelectronics (IMAPS US).
5. Collins, P.G. and Avouris, P. (2000), "Nanotubes for electronics", Scientific American, December, pp. 62-9.
6. Daoqiang, L., Tong, Q.K. and Wong, C.P. (1999), "Conductivity mechanisms of isotropic conductive adhesives (ICAs)", IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22 No. 3, pp. 223-7.
7. De, S., Lyons, P.E., Sorel, S., Doherty, E.M., King, P.J., Blau, W.J., Nirmalraj, P.N., Boland, J.J., Scardaci, V., Joimel, J. and Coleman, J.N. (2009), "Transparent, flexible, and highly conductive thin films based on polymernanotube composites", ACS Nano, Vol. 3 No. 3, pp. 714-20.
8. Dziedzic, A. and Slobodzian, P. (2011), "Modern microelectronic technologies in fabrication of RFID tags", Radioengineering, Vol. 20, pp. 187-93.
9. Dziedzic, A., Markowski, P. and Slobodzian, P. (2010), Anteny znaczników RFID-wybrane problemy materialowe i technologiczne, Monograph of Tele & Radio Research Institute, Warsaw, pp. 98-109.
10. Futera, K., Jakubowska, M. and Koziol, G. (2010), "Printed electronic on flexible and glass substrates", Proceedings of SPIE, Vol. 7745, p. 77451B.
11. Gilleo, K. (2010), "Flip chip assembly with conductive adhesives", Proc. of Int. Conf. on High-Density Interconnect and Systems Packaging, pp. 256-60.
12. Janeczek, K., Mložniak, A., Koziol, G., Araźna, A., Jakubowska, M. and Bajurko, P. (2010), "Screen printed UHF antennas on flexible substrates", Proceedings of SPIE, Vol. 7745, p. 77451B.
13. Kolbe, J. (2011), "Joining dies to RFID transponders via preapplied adhesives", Proc. EMPC, Bournemouth.
14. Li, J. and Lumpp, J.K. (2006), "Electrical and mechanical characterization of carbon nanotube filled conductive adhesive", IEEE Proceedings of Aerospace Conference, New York, NY, pp. 1-6.
15. Morris, J.E., Niiranen, S. and Mattila, T. (2010), "Mechanical cycling of isotropic conductive adhesives", Proc. of 33rd International Spring Seminar on Electronics Technology (ISSE), Warsaw, pp. 151-5.
16. Pudas, M., Halonen, N., Granat, P. and Vahakangas, J. (2005), "Gravure printing of conductive particulate polymer inks on flexible substrates", Progress in Organic Coatings, Vol. 54 No. 4, pp. 310-16.
17. Rasul, J.S. (2004), "Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications", Microelectronics Reliability, Vol. 44, pp. 135-40.
18. Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H. and Sharif, A. (2005), "The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing", Soldering & Surface Mount Technology, Vol. 17 No. 2, pp. 40-8.
19. Roesner, B. (1998), "The beneficial effect of underfilling on the reliability of flip-chip joints", Soldering & Surface Mount Technology, Vol. 10 No. 2, pp. 14-18.
20. Shin, D.-Y., Lee, Y. and Kim, C.H. (2009), "Performance characterization of screen printed radio frequency identification antennas with silver nanopaste", Thin Solid Films, Vol. 517 No. 21, pp. 6112-8.
21. Teramoto, A., Murakoshi, T., Tsuzaka, M. and Fujita, H. (2007), "Automated solder inspection technique for BGAmounted substrates by means of oblique computed tomography", IEEE Transactions on Electronics Packaging Manufacturing, Vol. 30 No. 4, pp. 285-92.
22. Van den Brand, J., Kusters, R., Heeren, M., van Remoortere, B. and Dietzel, A. (2010), "Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry", Proc. of 3rd Electronic System-Integration Technology Conference (ESTC), Berlin, pp. 1-6.