Mechanical cycling of isotropic conductive adhesives

ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings

Volumn , Issue , 2010, Pages 151-155

  Morris, J E ^a   Niiranen, Sini ^b   Mattila, Toni ^b  

^a Department of Electrical and Computer Engineering   (United States)

^b AALTO UNIVERSITY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT TEMPERATURES; EPOXY MATRICES; FAILURE MECHANISM; FILLER PARTICLES; ISOTROPIC CONDUCTIVE ADHESIVES; MECHANICAL CYCLING; MECHANICAL SHEAR; STRESS PLATEAU; VISCOELASTIC BEHAVIORS;

ADHESIVES; NANOTECHNOLOGY; TECHNICAL PRESENTATIONS;

STRESSES;

EID: 77956975739     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2010.5547275     Document Type: Conference Paper

References (11)

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