Performance characterization of screen printed radio frequency identification antennas with silver nanopaste

Thin Solid Films

Volumn 517, Issue 21, 2009, Pages 6112-6118

  Shin, Dong Youn ^a   Lee, Yongshik ^b   Kim, Chung Hwan ^a  

^a Korea Institute of Machine and Materials   (South Korea)

^b Yonsei University   (South Korea)

Author keywords

Radio frequency identification; Screen printing; Silver nanopaste; Skin effect; Surface roughness

Indexed keywords

DESIGN RULES; ELECTRONIC APPLIANCES; GRAPHIC ARTS; LOW COSTS; MANUFACTURING COST; MANUFACTURING METHODS; MICRO-PARTICLES; PERFORMANCE CHARACTERIZATION; PRINTING PROCESS; RADIATION PERFORMANCE; RADIOFREQUENCY IDENTIFICATION TAGS; RF-ID TAGS; SCREEN-PRINTED; SILVER PASTES; WIRELESS COMMUNICATIONS;

ANTENNAS; ELECTRIC CONDUCTORS; PRINTING PRESSES; RADIO FREQUENCY IDENTIFICATION (RFID); RADIO NAVIGATION; RADIO WAVES; SCREEN PRINTING; SKIN; SURFACE PROPERTIES; SURFACE ROUGHNESS;

SILVER;

EID: 67249090861     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.05.019     Document Type: Article

References (40)

1. Teng K.F., and Vest R.W. IEEE Trans. Component Hybrids 11 (1988) 291
2. Leppavuori S., Vaánanen J., Lahti M., Remes J., and Uusimaki A. Sens. Actuators, A, Phys. 41/42 (1994) 593
3. Lahti M., Leppävuori S., and Lantto V. Appl. Surf. Sci. 142 (1999) 367
4. Sirringhaus H., Kawase T., Friend R.H., Shimoda T., Inbasekaran M., Wu W., and Woo E.P. Science 290 (2000) 2123
5. Liu Y., Cui T., and Varahramyan K. Solid State Electron. 47 (2003) 1543
6. Chen B., Cui T., Liu Y., and Varahramyan K. Solid State Electron. 47 (2003) 841
7. Smith P.J., Shin D.Y., Stringer J.E., and Derby B. J. Mater. Sci. 41 (2006) 4154
8. Lee T.M., Kang T.G., Yang J.S., Jo J., Kim K.Y., Choi B.O., and Kim D.S. IEEE Trans. Electron. Packag. Manuf. 31 (2008)
9. Koo H.S., Chen M., and Pan P.C. Thin Solid Films 515 (2006) 896
10. Shimoda T., Morii K., Seki S., and Kiguchi H. MRS Bull. 28 (2003) 821
11. Street R.A., Wong W.S., Ready S.E., Chabinyc M.L., Arias A.C., Limb S., Salleo A., and Lujan R. Mater. Today 9 (2006) 32
12. Lee T.M., Choi Y.J., Nam S.Y., You C.W., Na D.Y., Choi H.C., Shin D.Y., Kim K.Y., and Jung K.I. Thin Solid Films 516 (2008) 7875
13. Berggren M., Nilsson D., and Robinson N.D. Nat. Mater. 6 (2007) 3
14. Yang L., Rida A., Vyas R., and Tentzeris M.M. IEEE Trans. Microwave Theor. 55 (2007) 2894
15. Kowalik T., Worch S., Hartwig A., and Joachimi H. Macromol. Symp. 254 (2007) 300
16. ISO/IEC 18000 - RFID Air Interface Standards.
17. Vest R.W. In: Wachtman J.B., and Haber R.A. (Eds). Ceramic Films and Coatings (1993), NJ/Noyes Publications, Park Ridge
18. Rozenberg G.G., Bresler E., Speakman S.P., Jeynes C., and Steinke J.H.G. Appl. Phys. Lett. 81 (2002) 5249
19. Dearden A.L., Smith P.J., Shin D.Y., Reis N., Derby B., and O'Brien P. Macromol. Rapid Commun. 26 (2005) 315
20. Buffat Ph., and Borel J.-P. Phys. Rev. A. 13 (1976) 2287
21. Qi W.H., and Wang M.P. Mater. Chem. Phys. 88 (2004) 280
22. Jiang H., Moon K.S., Dong H., Hua F., and Wong C.P. Chem. Phys. Lett. 429 (2006) 492
23. Qi W.H. Physica B 368 (2005) 46
24. Bet S., and Kar A. Mat. Sci. Eng. B-Solid. 130 (2006) 228
25. Quaas M., Shyjumon I., Hippler R., and Wulff H. Z. Kristallogr. 2007 (2007) 267
26. Lenggoro I.W., Widiyandari H., Hogan Jr. C.J., Biswas P., and Okuyama K. Anal. Chim. Acta. 585 (2007) 193
27. Choi M.C., Kim Y., and Ha C.S. Prog. Polym. Sci. 33 (2008) 581-630
28. Seo D.S., Park S.H., and Lee J.K. Curr. Appl. Phys. 9 (2009) S72
29. Lewis J.A. J. Am. Ceram. Soc. 83 (2000) 2341
30. Renger C., Kuschel P., Kristoffersson A., Clauss B., Oppermann W., and Sigmund W. J. Eur. Ceram. Soc. 27 (2007) 2361
31. Chu T.M.G., and Halloran J.W. J. Am. Ceram. Soc. 83 (2000) 2189
32. H. Kipphan, Handbook of Print Media, Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, Berlin, 2001.
33. Owczarek J.A., and Howland F.L. IEEE Trans. Components Hybrids 13 (1990) 358
34. Owczarek J.A., and Howland F.L. IEEE Trans. Components Hybrids 13 (1990) 368
35. Halliday D., and Resnick R. Fundamentals of Physics (1988), John Wiley & Sons, Inc., New-York, NY
36. Nilsson J.W., and Riedel S.A. Electric Circuits (1993), Addison-Wesley Publishing Co. Inc., New-York, NY
37. Zou G., Grönqvist H., Starski J.P., and Liu J. IEEE T. Adv. Packaging 25 (2002) 503
38. Rojansky V., and Winebrand M. IEEE Antennas and Propagation Society, AP-S International Symposium, Atlanta, GA, U.S.A., June 21-26 (1998) 1348
39. Yazdandoost K.Y., and Sato K. MHS 2001. Proceedings of 2001 International Symposium on Micromechatronics and Human Science, Nagoya, Japan, September 9-12 (2001) 41
40. Sidén J., Olsson T., Koptiou A., and Nilsson H.E. Polytronic 2005. Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, October 23-26 (2005) 86