The beneficial effect of underfilling on the reliability of flip-chip joints

Soldering and Surface Mount Technology

Volumn 10, Issue 2, 1998, Pages 14-18

  Roesner, Bela ^a  

^a Thomson Multimedia   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; INTEGRATED CIRCUIT MANUFACTURE; RELIABILITY; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL CYCLING; COST ACCOUNTING; DETERIORATION; ELECTRIC RESISTANCE; INTERCONNECTION NETWORKS; ISOTOPES;

FLIP CHIP JOINTS; UNDERFILLING; BUMP INTERCONNECTION; FLIP-CHIP JOINTS; THERMAL SHOCK; UNDERFILL MATERIALS;

FLIP CHIP DEVICES;

EID: 0032068438     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540919810219921     Document Type: Article

References (7)

1. Babiarz, A.J. (1997), "Key process controls for underfilling flipchips", Solid State Technology, April, pp. 77-81.
2. Baraton, X. et al. (1997), "Thermal fatigue of solder flip-chip assemblies". Proceedings, 11th European Microelectronics Conference, Venice, May, pp. 191-96.
3. Boustedt, K. and Hedemalm, P. (1995), "The Nordic flip-chip project experimental studies", Proceedings, 10th European Microelectronics Conference, May. pp. 493-8.
4. Cooley, R.F. (1994), "Low cost MCM-L flip-chip interconnection utilising gold ball pumping", Proceedings, International Symposium on Microelectronics, Boston, MA, November, pp. 473-78.
5. Hayes, D.J. and Wallace, D.B. (1996), "Solderjet printing for low-cost wafer bumping", Proceedings, International Symposium on Microelectronics, Minneapolis, MN, October, pp. 296-301.
6. Roesner, B. (1995), "Reliability study of polymer adhesive bump interconnections", Journal of Electronics Manufacturing, Vol. 5 No. 4, December, pp. 297-300.
7. US Patent No. 5074947, December 1991.