Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Van Den Brand, Jeroen ^a   Kusters, Roel ^a   Heeren, Mark ^a   Van Remoortere, Bart ^a   Dietzel, Andreas ^a  

^a TNO   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ALL-PRINTED; ANISOTROPIC CONDUCTIVE ADHESIVES; BONDING FORCES; COST EFFECTIVE; FLIP CHIP BONDING; LOW COSTS; LOW-TEMPERATURE STABILITY; PRINTED CIRCUITRY; PRINTED ELECTRONICS; RESEARCH EFFORTS; SI CHIPS; SMART ELECTRONICS; SUBSTRATE MATERIAL; ULTRA-THIN;

DIES; SUBSTRATES;

ADHESIVE JOINTS;

EID: 78651287374     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642872     Document Type: Conference Paper

References (12)

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