Underfill selection, characterization, and reliability study for fine-pitch, large die Cu/Low-K flip chip package

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 3, 2011, Pages 279-290

  Ong, Yue Ying ^a   Ho, Soon Wee ^a   Sekhar, Vasarla Nagendra ^a   Ong, Xuefen ^a,b   Ong, Jimmy ^a,b   Zhang, Xiaowu ^a   Vaidyanathan, Kripesh ^a   Yoon, Seung Uk ^a   Lau, John H ^a   Kheng, Lim Yeow ^b   Yeo, David ^b   Chan, Kai Chong ^b   Zhang, Yanfeng ^b   Tan, Juan Boon ^b   Sohn, Dong Kyun ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

Author keywords

Cu low K packaging; fine pitch; large die; reliability; underfill selection and characterization

Indexed keywords

65-NM TECHNOLOGIES; CHARACTERIZATION METHODS; CU/LOW-K; CU/LOW-K FLIP CHIP; FINE PITCH; INITIAL STAGES; RELIABILITY TEST; UNDERFILLS;

CHARACTERIZATION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES;

RELIABILITY;

EID: 84863150461     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2010.2100433     Document Type: Article

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