Underfill selection strategy for low k, high lead/lead-free flip chip application

Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

Volumn , Issue , 2007, Pages 338-341

  Lee, W H ^a   Jiang, D S ^a   Wang, Y P ^a   Hsiao, C S ^a  

^a SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; DELAMINATION; DIELECTRIC MATERIALS; ELECTRONIC EQUIPMENT MANUFACTURE; ERROR ANALYSIS; FLIP CHIP DEVICES; MECHANICAL PROPERTIES; MICROSYSTEMS; NONMETALS; PACKAGING MATERIALS; SILICON; STRESSES; TECHNOLOGY; WELDING; WIRELESS TELECOMMUNICATION SYSTEMS;

APPLICATIONS.; DIE STRESS; DIELECTRIC LAYERS; FLIP CHIPPING; FLIP-CHIP PACKAGING; HIGH PROBABILITY; LOW-K DIELECTRICS; PACKAGING PROCESSES; PROPERTY TESTING; QUALIFICATION TESTING; RELIABILITY REQUIREMENTS; RELIABILITY TESTING; SELECTION PROCESSES; SELECTION STRATEGIES; SILICON TECHNOLOGIES; SOLDER JOINTS; UNDERFILL; UNDERFILL MATERIALS; UNDERFILLS;

CHIP SCALE PACKAGES;

EID: 48649083547     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2007.4433631     Document Type: Conference Paper

References (5)

1. N. Islam, M. Jimarez, R. Darveaux, J. Y. Lee, J. Y. Na, K. S. Kim, "Robust Underfill Selection Methodology for Flip Chip", Proceedings of IPACK, 2007.
2. K. M. Chen et al, "Effects of Underfill Materials on the reliability of Low-k Flip Chip Packaging", Microelectronics Reliability, Vol. 46, No. 1, 2006, pp.155-163.
3. Mudasir Ahmad, Sue Teng, and Jie Xue, "Effect of Underfill Material Properties on Low K Dielectric, First and Second Level Reliability Interconnect", IMPAS, 2006.
4. Lianhua Fan, Kyoung-sik Moon and C. P. Wong, "Adhesion of Underfill and Components in Flip Chip Encapsulation", J. Adhesion Sci. Technol., Vol. 16, No. 2, pp. 213-223, 2002..
5. W. H. Lee, D. S. Jiang, Y. P. Wang, C. S. Hsiao, "Thermal Degradation and Mass Transport of Underfill Material", Proceedings of IPACK, 2007.