Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation

Microelectronics Reliability

Volumn 52, Issue 6, 2012, Pages 1157-1164

  Zhang, Wenjing ^a   Luo, Wei ^a   Hu, Anmin ^a   Li, Ming ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION IMPROVEMENT; ADHESION PERFORMANCE; BUTTON SHEAR TESTS; CIRCULAR SURFACES; COHESIVE FAILURES; CU-BASED; EPOXY MOLDING COMPOUNDS; FAILURE PATHS; FORCE-DISPLACEMENT CURVES; FRACTURE SURFACES; HIERARCHICAL STRUCTURES; INTERFACE ADHESION; INTERFACIAL ADHESION STRENGTH; MECHANICAL INTERLOCKING; MICROELECTRONIC INDUSTRY; POROUS OXIDES; PRACTICAL PROCESS; ROOT DIAMETERS; STANDARD INTERFACE; STANDARD SAMPLES; SURFACE OBSERVATION; TREATMENT METHODS; WIRE BONDING;

ADHESION; BOND STRENGTH (MATERIALS); COPPER; ELECTROLESS PLATING; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; MICROELECTRONICS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES;

INTERFACES (MATERIALS);

EID: 84862830770     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.12.024     Document Type: Article

References (18)

1. S.J. Cho, and K.W. Paik oxidation studies on a Cu-base leadframe alloy between 150°C and 300°C Scripta Mater 38 1998 1149 1154
2. T. Hang, H.Q. Ling, Z.J. Xiu, M. Li, and D.L. Mao Study on the adhesion between epoxy molding compound and nanocone-arrayed pd preplated leadframes J Electron Mater 36 2007 1594 1598
3. H.Y. Lee, and G.S. Park Failure paths at copper-base leadframe/epoxy molding compound interfaces J Mater Sci 37 2002 4247 4257
4. H.Y. Lee, Y.H. Kim, and Y.K. Chang Fracture behaviors of nanowire-coated metal/polymer systems under mode-I loading condition Acta Mater 52 2004 5815 5828
5. H.Y. Lee, Y.B. Park, I. Jeon, Y.H. Kim, and Y.K. Chang Analysis of failure of nanobelt-coated copper-based leadframe/epoxy-based molding compound systems after pull-out test Mater Sci Eng a-Struct 405 2005 50 64
6. N. Srikanth, L. Chan, and C.J. Vath Adhesion improvement of EMC-leadframe interface using brown oxide promoters Thin Solid Films 504 2006 397 400
7. M. Komatsu, and H. Mori In situ HVEM study on copper oxidation using an improved environmental cell J Electron Microsc 54 2005 99 107
8. X. Chen, A.M. Hu, M. Li, and D.L. Mao Oxidation of lead frame copper alloys with different compositions and its effect on oxide film adhesion J Electron Mater 38 2009 372 378
9. A.M. Hu, J. Gao, M. Li, and D.L. Mao Influence of crystal orientation on copper oxidation failure Appl Surf Sci 255 2009 5943 5947
10. A.M. Hu, W.Y. Gen, X. Chen, and M. Li Effect of Ag on oxidation of Cu-base leadframe Microelectron Reliab 51 2011 866 870
11. Zhao W, Wu J, Hu A, Li M, Mao D. An investigation into copper oxidation behavior. In: 2010 11th international conference on electronic packaging technology & high density packaging; 2010. p. 319-23.
12. S.B. Jung, J.M. Koo, Y.N. Kim, J.W. Yoon, D.G. Kim, and B.I. Noh Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages Mater Sci Eng a-Struct 483-84 2008 620 624
13. J.K. Kim, R.S.C. Woo, P.Y.P. Hung, and M. Lebbai Adhesion performance of black oxide coated copper substrates: effects of moisture sensitivity test Surf Coat Tech 201 2006 320 328
14. R. Haugsrud, and P. Kofstad On the high-temperature oxidation of Cu-rich Cu-Ni alloys Oxid Met 50 1998 189 213
15. W. Bruckner, S. Baunack, G. Reiss, G. Leitner, and T. Knuth Oxidation behaviour of Cu-Ni (Mn) (constantan) films Thin Solid Films 258 1995 252 259
16. Y.T. Qian, Z.P. Liu, S. Li, Y. Yang, S. Peng, and Z.K. Hu Complex-surfactant-assisted hydrothermal route to ferromagnetic nickel nanobelts Adv Mater 15 2003 1946 1948
17. J.P. Zhang Fatigue crack propagation behavior of underfill materials in microelectronic packaging Mater Sci Eng a-Struct 314 2001 194 200
18. M. Goroll, and R. Pufall New aspects in characterization of adhesion of moulding compounds on different surfaces by using a simple button-shear-test method for lifetime prediction of power devices Microelectron Reliab 50 2010 1684 1687