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Volumn 405, Issue 1-2, 2005, Pages 50-64
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Analysis of failure of nanobelt-coated copper-based leadframe/ epoxy-based molding compound systems after pull-out test
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Author keywords
Adhesion; Epoxy; Failure path; Leadframe; Nanobelt; Phase angle
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Indexed keywords
ADHESION;
COPPER;
EPOXY RESINS;
FAILURE ANALYSIS;
FINITE ELEMENT METHOD;
LEAD;
MATERIALS TESTING;
MATHEMATICAL MODELS;
NANOSTRUCTURED MATERIALS;
SHEET MOLDING COMPOUNDS;
SURFACE TREATMENT;
EPOXY MOLDING COMPOUNDS;
FAILURE PATH;
LEADFRAME;
NANOBELT;
PHASE ANGLE;
PULL-OUT TEST;
INTERFACES (MATERIALS);
FAILURE;
MOLDING;
TESTING;
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EID: 24344498718
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2005.06.042 Document Type: Article |
Times cited : (18)
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References (21)
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