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Volumn 405, Issue 1-2, 2005, Pages 50-64

Analysis of failure of nanobelt-coated copper-based leadframe/ epoxy-based molding compound systems after pull-out test

Author keywords

Adhesion; Epoxy; Failure path; Leadframe; Nanobelt; Phase angle

Indexed keywords

ADHESION; COPPER; EPOXY RESINS; FAILURE ANALYSIS; FINITE ELEMENT METHOD; LEAD; MATERIALS TESTING; MATHEMATICAL MODELS; NANOSTRUCTURED MATERIALS; SHEET MOLDING COMPOUNDS; SURFACE TREATMENT;

EID: 24344498718     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.06.042     Document Type: Article
Times cited : (18)

References (21)
  • 19
    • 0141852861 scopus 로고    scopus 로고
    • Version 6.0, Hibbit, Karlson and Sorensen Inc., Pawtucket, RI
    • ABAQUS User's Manual, Version 6.0, Hibbit, Karlson and Sorensen Inc., Pawtucket, RI, 1999.
    • (1999) ABAQUS User's Manual


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.