SCOPUS 정보 검색 플랫폼

Journal of Materials Science

Volumn 37, Issue 19, 2002, Pages 4247-4257

Failure paths at copper-base leadframe/epoxy molding compound interfaces

(2) Lee, H Y a Park, G S b

a Seoul National University (South Korea)

b Samsung Advanced Institute of Technology (SAIT) (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; AUGER ELECTRON SPECTROSCOPY; CANTILEVER BEAMS; COPPER OXIDES; ENERGY DISPERSIVE SPECTROSCOPY; FAILURE (MECHANICAL); INTERFACES (MATERIALS); LEAD; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

COPPER-BASE LEADFRAMES; EPOXY MOLDING COMPOUNDS (EMC);

SHEET MOLDING COMPOUNDS;

EID: 0036773190 PISSN: 00222461 EISSN: None Source Type: Journal
DOI: 10.1023/A:1020012625149 Document Type: Article

Times cited : (14)

References (16)

1
- 0032477952
- S.J. Cho and K.W. Paik, Scr. Mater. 38 (1998) 1149.
- (1998) Scr. Mater. , vol.38 , pp. 1149
- Cho, S.J.¹ Paik, K.W.²

2
- 0031146933
- S.J. Cho, K.-W. Paik and Y.-G. Kim, IEEE Trans. CPMT, B 20 (1997) 167.
- (1997) IEEE Trans. CPMT, B , vol.20 , pp. 167
- Cho, S.J.¹ Paik, K.-W.² Kim, Y.-G.³

3
- 0029492993
- IEEE, Piscataway, NJ
- G.L. Ang, L.C. Goh, K.W. Heng and S.K. Lahiri, in Proc. 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (IEEE, Piscataway, NJ, 1995) p. 218.
- (1995) Proc. 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) , pp. 218
- Ang, G.L.¹ Goh, L.C.² Heng, K.W.³ Lahiri, S.K.⁴

4
- 0031141613
- T. Saitoh and M. Toya, IEEE Trans. CPMT, B 20 (1997) 176.
- (1997) IEEE Trans. CPMT, B , vol.20 , pp. 176
- Saitoh, T.¹ Toya, M.²

5
- 0031197685
- S. Yi, J.S. Goh and J.C. Yang, ibid. 20(1997) 247.
- (1997) IEEE Trans. CPMT, B , vol.20 , pp. 247
- Yi, S.¹ Goh, J.S.² Yang, J.C.³

6
- 0032293107
- S. Yi and K.Y. Sze, ASME Trans. J. Electronic Packaging 120 (1998) 385.
- (1998) ASME Trans. J. Electronic Packaging , vol.120 , pp. 385
- Yi, S.¹ Sze, K.Y.²

7
- 0026406133
- S. Kim, IEEE Trans. CHMT, B 14 (1991) 809.
- (1991) IEEE Trans. CHMT, B , vol.14 , pp. 809
- Kim, S.¹

8
- 84972955601
- B.J. Love and P.F. Packman, J. Adhesion 40 (1993) 139.
- (1993) J. Adhesion , vol.40 , pp. 139
- Love, B.J.¹ Packman, P.F.²

9
- 0001160510
- H.K. Yun, K. Cho, J.H. An and C.E. Park, J. Mater. Sci. 27 (1992) 5811.
- (1992) J. Mater. Sci. , vol.27 , pp. 5811
- Yun, H.K.¹ Cho, K.² An, J.H.³ Park, C.E.⁴

10
- 0018048437
- J.R.G. Evans and D.E. Packham, J. Adhesion 9 (1978) 267.
- (1978) J. Adhesion , vol.9 , pp. 267
- Evans, J.R.G.¹ Packham, D.E.²

11
- 0024301167
- Z. Suo and J.W. Hutchinson, Mater. Sci. Eng. A 107 (1989) 135.
- (1989) Mater. Sci. Eng. A , vol.107 , pp. 135
- Suo, Z.¹ Hutchinson, J.W.²

12
- 0023602637
- T.S. Oh, R.M. Cannon and R.O. Ritchie, J. Amer. Ceram. Soc. 70 (1987) C352.
- (1987) J. Amer. Ceram. Soc. , vol.70
- Oh, T.S.¹ Cannon, R.M.² Ritchie, R.O.³

13
- 0001365112
- H.Y. Lee and J. Yu, Mater. Sci. Eng. A 277 (2000) 154.
- (2000) Mater. Sci. Eng. A , vol.277 , pp. 154
- Lee, H.Y.¹ Yu, J.²

14
- 0003923309
- Maxwell Macmillan
- D.A. Jones, "Principles and Prevention of Corrosion" (Maxwell Macmillan, 1992) p. 411.
- (1992) Principles and Prevention of Corrosion , pp. 411
- Jones, D.A.¹

15
- 0007329633
- edited by J. Schou, P. Kruit, and D.E. Newbury
- M. Cailler and J.-P. Ganachaud, in "Scanning Microsc. Suppl.," 4th ed., edited by J. Schou, P. Kruit, and D.E. Newbury, p. 57.
- Scanning Microsc. Suppl., 4th ed. , pp. 57
- Cailler, M.¹ Ganachaud, J.-P.²

16
- 0002517257
- edited by J. Schou, P. Kruit and D.E. Newbury
- Idem., "Scanning Microsc. Suppl.," 4th ed. edited by J. Schou, P. Kruit and D.E. Newbury, p. 81.
- Scanning Microsc. Suppl., 4th ed. , pp. 81
- Cailler, M.¹ Ganachaud, J.-P.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.