SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 2, 2009, Pages 372-378

Oxidation of lead frame copper alloys with different compositions and its effect on oxide film adhesion

(4) Chen, Xi a Hu, Anmin a Li, Ming a Mao, Dali a

a SHANGHAI JIAO TONG UNIVERSITY (China)

Author keywords

Adhesion strength; Diffusion; Lead frame copper alloy; Oxidation

Indexed keywords

ADHESION STRENGTH; ALLOY SUBSTRATES; BASIC STRUCTURES; COPPER OXIDE FILMS; FILM ADHESIONS; FILM STRUCTURES; LEAD FRAME COPPER ALLOY; OXIDATION RATES; PEEL TESTS; THINNER OXIDES;

ADHESION; BOND STRENGTH (MATERIALS); COPPER; COPPER ALLOYS; COPPER OXIDES; INORGANIC COATINGS; METALLIC COMPOUNDS; OXIDATION; OXIDE FILMS; THICKNESS MEASUREMENT;

ALLOYS;

EID: 58349122241 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0585-2 Document Type: Article

Times cited : (5)

References (18)

1
- 0038498828
- 10.1007/s11664-003-0143-x
- M. Lebbai J.K. Kim M.M.F. Yuen 2003 J. Electron. Mater. 32 564 10.1007/s11664-003-0143-x
- (2003) J. Electron. Mater. , vol.32 , pp. 564
- Lebbai, M.¹ Kim, J.K.² Yuen, M.M.F.³

2
- 33745938064
- 10.1016/j.surfcoat.2005.11.121
- J.K. Kim R.S.C. Woo P.Y.P. Hung M. Lebbai 2006 Surf. Coat. Tech. 201 320 10.1016/j.surfcoat.2005.11.121
- (2006) Surf. Coat. Tech. , vol.201 , pp. 320
- Kim, J.K.¹ Woo, R.S.C.² Hung, P.Y.P.³ Lebbai, M.⁴

3
- 33749342973
- 10.1007/s11664-006-0227-5
- X. Chen M. Li X.X. Ren A.M. Hu D.L. Mao 2006 J. Electron. Mater. 35 1734 10.1007/s11664-006-0227-5
- (2006) J. Electron. Mater. , vol.35 , pp. 1734
- Chen, X.¹ Li, M.² Ren, X.X.³ Hu, A.M.⁴ Mao, D.L.⁵

4
- 0032093702
- 10.1016/S0026-2692(97)00052-9
- S.K. Lahiri N.K.W. Singh K.W. Heng L. Ang L.C. Goh 1998 Microelectron. J. 29 335 10.1016/S0026-2692(97)00052-9
- (1998) Microelectron. J. , vol.29 , pp. 335
- Lahiri, S.K.¹ Singh, N.K.W.² Heng, K.W.³ Ang, L.⁴ Goh, L.C.⁵

5
- 0032477952
- 10.1016/S1359-6462(98)00012-8
- S.J. Cho K.W. Paik 1998 Scr. Mater. 38 1149 10.1016/S1359-6462(98)00012-8
- (1998) Scr. Mater. , vol.38 , pp. 1149
- Cho, S.J.¹ Paik, K.W.²

6
- 0032630749
- Y, Tomioka and J. Miyake, Proc. 49 th Electronic Components and Technology Conference, 1999, p. 714.
- (1999) Proc. 49 Th Electronic Components and Technology Conference , pp. 714
- Tomioka, Y.¹ Miyake, J.²

7
- 33750411707
- H. Shen M. Li D.L. Mao 2006 Rare Metal. Mater. Des. 35 109
- (2006) Rare Metal. Mater. Des. , vol.35 , pp. 109
- Shen, H.¹ Li, M.² Mao, D.L.³

8
- 0032673606
- 10.1016/S0169-4332(98)00764-8
- B. Timmermans F. Reniers 1999 Appl. Surf. Sci. 144-145 54 10.1016/S0169-4332(98)00764-8
- (1999) Appl. Surf. Sci. , vol.144-145 , pp. 54
- Timmermans, B.¹ Reniers, F.²

9
- 0000815427
- 10.1016/0001-6160(56)90133-X
- R. Kenneth A.T. Lawless 1956 Acta Mater. 4 153 10.1016/0001-6160(56) 90133-X
- (1956) Acta Mater. , vol.4 , pp. 153
- Kenneth, R.¹ Lawless, A.T.²

10
- 28844472499
- 10.1163/156855405774984020
- J.K. Kim M. Lebbai R.S.C. Woo 2005 Compos. Interface. 12 739 10.1163/156855405774984020
- (2005) Compos. Interface. , vol.12 , pp. 739
- Kim, J.K.¹ Lebbai, M.² Woo, R.S.C.³

11
- 0345727696
- A.D. Le Claire 1963 J. Appl. Phys. 14 351
- (1963) J. Appl. Phys. , vol.14 , pp. 351
- Le Claire, A.D.¹

12
- 24344498718
- 10.1016/j.msea.2005.06.042
- H.Y. Lee Y.B. Park I. Jeon Y.H. Kim Y.K. Chang 2005 Mater. Sci. Eng. A 405 50 10.1016/j.msea.2005.06.042
- (2005) Mater. Sci. Eng. A , vol.405 , pp. 50
- Lee, H.Y.¹ Park, Y.B.² Jeon, I.³ Kim, Y.H.⁴ Chang, Y.K.⁵

13
- 0033731389
- 1. 10.1109/6104.827524
- K.S. Choi T.G. Kang I.S. Park J.H. Lee K.B. Cha 2000 IEEE Trans. Electron. Packag. 23 1 32 10.1109/6104.827524
- (2000) IEEE Trans. Electron. Packag. , vol.23 , pp. 32
- Choi, K.S.¹ Kang, T.G.² Park, I.S.³ Lee, J.H.⁴ Cha, K.B.⁵

14
- 31644443259
- 10.1007/s00170-004-2310-5
- T.C. Liu R.K. Li M.C. Chen 2006 Int. J. Adv. Manuf. Technol. 27 1211 10.1007/s00170-004-2310-5
- (2006) Int. J. Adv. Manuf. Technol. , vol.27 , pp. 1211
- Liu, T.C.¹ Li, R.K.² Chen, M.C.³

15
- 33645150258
- 10.1002/pc.20155
- E. Kalfon H. Harel G. Marom E. Drukker A.K. Green I. Kressel 2005 Polym. Compos. 26 770 10.1002/pc.20155
- (2005) Polym. Compos. , vol.26 , pp. 770
- Kalfon, E.¹ Harel, H.² Marom, G.³ Drukker, E.⁴ Green, A.K.⁵ Kressel, I.⁶

16
- 0141903355
- 10.1163/156856103769207392
- M. Lebbai J.K. Kim W.K. Szeto 2003 J. Adhes. Sci. Technol. 17 1543 10.1163/156856103769207392
- (2003) J. Adhes. Sci. Technol. , vol.17 , pp. 1543
- Lebbai, M.¹ Kim, J.K.² Szeto, W.K.³

17
- 0343189225
- 10.1080/00218469908015924
- B.J. Love J. Baborowski M. Charbonnier M. Romand 1999 J. Adhes. 69 165 10.1080/00218469908015924
- (1999) J. Adhes. , vol.69 , pp. 165
- Love, B.J.¹ Baborowski, J.² Charbonnier, M.³ Romand, M.⁴

18
- 0038160330
- 10.1007/s11664-003-0142-y
- M. Lebbai J.K. Kim W.K. Szeto M.M.F. Yuen P. Tong 2003 J. Electron. Mater. 32 558 10.1007/s11664-003-0142-y
- (2003) J. Electron. Mater. , vol.32 , pp. 558
- Lebbai, M.¹ Kim, J.K.² Szeto, W.K.³ Yuen, M.M.F.⁴ Tong, P.⁵

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