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Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 319-323

An investigation into copper oxidation behavior

(5) Zhao, Wenting a Wu, Jiechen a Hu, Anmin a Li, Ming a Mao, Dali a

a SHANGHAI JIAO TONG UNIVERSITY (China)

Author keywords

Copper alloy; Diffusion coefficient; Electronic packaging; Lead frame material; Oxidation

Indexed keywords

AMORPHOUS NICKEL; COPPER OXIDATION; DIFFERENT SUBSTRATES; DIFFUSION COEFFICIENT; DIRECT CURRENT; ELECTRODEPOSITED COPPER; ELECTRONIC DEVICE; ELECTRONIC PACKAGING; LEAD FRAME MATERIAL; OVERALL FAILURE; OXIDATION KINETICS;

ACTIVATION ENERGY; ALLOYS; CHIP SCALE PACKAGES; COPPER; COPPER ALLOYS; COPPER METALLOGRAPHY; COPPER OXIDES; DIFFUSION; ELECTRODEPOSITION; LEAD OXIDE; NICKEL; OXIDATION; OXIDATION RESISTANCE; PACKAGING; PHOSPHORUS;

SUBSTRATES;

EID: 78449267646 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ICEPT.2010.5582339 Document Type: Conference Paper

Times cited : (6)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.